Inventor · disambiguated record
Manfred Engelhardt
Also filed as: ENGELHARDT MANFRED
70 granted patents·18 pending applications·783 citations·filing 1979–2018
98Inventor score
Top patents by PatentIndex Score
88 records- 0197US9627287B2Thinning in package using separation structure as stopINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·153 cites·13 claims
- 0296US6030900AProcess for generating a space in a structureSIEMENS AG·Filed 1996·Granted Feb 29, 2000·356 cites·17 claims
- 0389US10032670B2Plasma dicing of silicon carbideINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 24, 2018·6 cites·27 claims
- 0483US9679773B1Method for thermal annealing and a semiconductor device formed by the methodINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 13, 2017·3 cites·23 claims
- 0583US8338317B2Method for processing a semiconductor wafer or die, and particle deposition deviceENGELHARDT MANFRED·Filed 2011·Granted Dec 25, 2012·7 cites·19 claims
- 0680US6387773B1Method for fabricating trenches having hallows along the trenches side wall for storage capacitors of DRAM semiconductor memoriesINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 14, 2002·22 cites·13 claims
- 0779US9219011B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·3 cites·12 claims
- 0879US8093637B2MIM capacitor and associated production methodENGELHARDT MANFRED·Filed 2006·Granted Jan 10, 2012·8 cites·23 claims
- 0978US8361884B2Plasma dicing and semiconductor devices formed thereofINFINEON TECHNOLOGIES AG·Filed 2010·Granted Jan 29, 2013·3 cites·28 claims
- 1076US9391263B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 1174US8906782B2Method of separating semiconductor die using material modificationENGELHARDT MANFRED·Filed 2012·Granted Dec 9, 2014·3 cites·15 claims
- 1273US7321097B2Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jan 22, 2008·16 cites·10 claims
- 1372US9006109B2Semiconductor devices and methods for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 14, 2015·2 cites·6 claims
- 1471US9275916B2Removable indicator structure in electronic chips of a common substrate for process adjustmentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·14 claims
- 1568US8877631B2Interconnect arrangement and associated production methodsENGELHARDT MANFRED·Filed 2011·Granted Nov 4, 2014·2 cites·10 claims
- 1667US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 1767US8462358B2Device for detecting movement and forcesBECKER FRANK·Filed 2007·Granted Jun 11, 2013·7 cites·12 claims
- 1866US9530618B2Plasma system, chuck and method of making a semiconductor deviceENGELHARDT MANFRED·Filed 2012·Granted Dec 27, 2016·1 cites·20 claims
- 1966US8575026B2Method of protecting sidewall surfaces of a semiconductor substrateENGELHARDT MANFRED·Filed 2011·Granted Nov 5, 2013·1 cites·20 claims
- 2063US6930052B2Method for producing an integrated circuit having at least one metalicized surfaceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 16, 2005·7 cites·10 claims
- 2160US8815706B2Methods of forming semiconductor devicesHIRSCHLER JOACHIM·Filed 2012·Granted Aug 26, 2014·1 cites·25 claims
- 2260US8158485B2Integrated circuit device having openings in a layered structureKOEHLER DANIEL·Filed 2007·Granted Apr 17, 2012·2 cites·45 claims
- 2360US6888244B2Interconnect arrangement and method for fabricating an interconnect arrangementINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 3, 2005·9 cites·22 claims
- 2459US9165895B2Method for separating a plurality of dies and a processing device for separating a plurality of diesBRUNNER HELMUT·Filed 2011·Granted Oct 20, 2015·2 cites·19 claims
- 2559US6864175B2Method for fabricating integrated circuit arrangements, and associated circuit arrangements, in particular tunnel contact elementsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 8, 2005·9 cites·13 claims
- 2659US4283849ACutting unit for a dry-shaving apparatusPHILIPS CORP·Filed 1979·Granted Aug 18, 1981·20 cites·3 claims
- 2758US10672716B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 2, 2020·0 cites·17 claims
- 2858US9608201B2Semiconductor devices having insulating substrates and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 28, 2017·0 cites·18 claims
- 2957US2017148981A1Semiconductor Devices Having Insulating Substrates and Methods of Formation ThereofINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 3056US10043683B2Plasma system, chuck and method of making a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 7, 2018·0 cites·21 claims
- 3156US9012325B2Method of protecting sidewall surfaces of a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·0 cites·19 claims
- 3256US6946386B2Process for producing ultrathin homogenous metal layersINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 20, 2005·3 cites·8 claims
- 3356US4275497AShaving apparatusPHILIPS CORP·Filed 1979·Granted Jun 30, 1981·18 cites·5 claims
- 3455US10622218B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 14, 2020·0 cites·16 claims
- 3555US6730562B2Method of patterning ferroelectric layersINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 4, 2004·4 cites·36 claims
- 3654US6454956B1Structuring methodINFINEON TECHNOLOGIES AG·Filed 1998·Granted Sep 24, 2002·18 cites·33 claims
- 3753US10236204B2Semiconductor processing systemINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 19, 2019·0 cites·3 claims
- 3853US9490103B2Separation of chips on a substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 8, 2016·0 cites·9 claims
- 3953US7045070B1Method of producing an electrode configuration and method of electrically contacting the electrode configurationINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 16, 2006·4 cites·16 claims
- 4053US2015044856A1Method of separating semiconductor die using material modificationINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 4152US8993422B2Process tools and methods of forming devices using process toolsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Mar 31, 2015·0 cites·24 claims
- 4252US8722514B2Semiconductor devices having insulating substrates and methods of formation thereofVON KOBLINSKI CARSTEN·Filed 2011·Granted May 13, 2014·0 cites·19 claims
- 4352US6296777B1Structuring processINFINEON TECHNOLOGIES AG·Filed 1998·Granted Oct 2, 2001·17 cites·22 claims
- 4451US10043640B2Process tools and methods of forming devices using process toolsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 7, 2018·0 cites·21 claims
- 4551US10020264B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 10, 2018·0 cites·17 claims
- 4651US9793129B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 17, 2017·0 cites·13 claims
- 4751US9481563B2Semiconductor device having a micro-mechanical structureINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 1, 2016·0 cites·16 claims
- 4851US9030744B2Fabrication of micro lensesENGELHARDT MANFRED·Filed 2011·Granted May 12, 2015·0 cites·25 claims
- 4950US9455192B2Kerf preparation for backside metallizationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 5050US6828680B2Integrated circuit configuration using spacers as a diffusion barrier and method of producing such an integrated circuit configurationINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 7, 2004·3 cites·11 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →