Inventor · disambiguated record

Jaehak Kim

Also filed as: KIM JAEHAK

1 granted patent·1 citations·filing 2006–2006

16Inventor score

Technology areasH10P

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0157US7459388B2Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stressesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 2, 2008·1 cites·19 claims

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Jaehak Kim — Patent Inventor | PatentIndex