Inventor · disambiguated record
Minoru Ueshima
Also filed as: UESHIMA MINORU
35 granted patents·5 pending applications·134 citations·filing 2002–2021
96Inventor score
Top patents by PatentIndex Score
40 records- 0190US7682468B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2007·Granted Mar 23, 2010·15 cites·9 claims
- 0284US7800230B2Solder preform and electronic componentDENSO CORP·Filed 2007·Granted Sep 21, 2010·12 cites·4 claims
- 0384US7282175B2Lead-free solderSENJU METAL INDUSTRY CO·Filed 2004·Granted Oct 16, 2007·32 cites·13 claims
- 0482US8845826B2Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solderKAWAMATA YUJI·Filed 2008·Granted Sep 30, 2014·11 cites·11 claims
- 0582US8343383B2Anisotropic conductive materialSENJU METAL INDUSTRY CO·Filed 2008·Granted Jan 1, 2013·3 cites·11 claims
- 0681US7338567B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Mar 4, 2008·19 cites·15 claims
- 0773US11217359B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2018·Granted Jan 4, 2022·0 cites·2 claims
- 0872US12119131B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 15, 2024·0 cites·9 claims
- 0972US9162324B2Solder paste and solder jointNAKANO KOSUKE·Filed 2006·Granted Oct 20, 2015·3 cites·12 claims
- 1071US9796053B2High-temperature lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Oct 24, 2017·3 cites·19 claims
- 1171US8334598B2Power semiconductor device and manufacturing method thereforNISHIBORI HIROSHI·Filed 2010·Granted Dec 18, 2012·5 cites·6 claims
- 1268US8303735B2Lead-free low-temperature solderUESHIMA MINORU·Filed 2006·Granted Nov 6, 2012·3 cites·16 claims
- 1367US9807889B2Method of mounting electronic component to circuit boardUNIV OSAKA·Filed 2013·Granted Oct 31, 2017·2 cites·2 claims
- 1465US8216395B2Lead-free solder alloyMUNEKATA OSAMU·Filed 2010·Granted Jul 10, 2012·3 cites·9 claims
- 1564US10297539B2Electronic device including soldered surface-mount componentSENJU METAL INDUSTRY CO·Filed 2015·Granted May 21, 2019·1 cites·13 claims
- 1664US10272527B2Solder alloy, and LED moduleSENJU METAL INDUSTRY CO·Filed 2015·Granted Apr 30, 2019·1 cites·19 claims
- 1764US9185812B2Lead-free solder pasteUESHIMA MINORU·Filed 2006·Granted Nov 10, 2015·2 cites·6 claims
- 1863US11331759B2Solder alloy for power devices and solder joint having a high current densitySENJU METAL INDUSTRY CO·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 1962US8888932B2Indium-containing lead-free solder for vehicle-mounted electronic circuitsKAWAMATA YUJI·Filed 2008·Granted Nov 18, 2014·2 cites·10 claims
- 2061US7029542B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2003·Granted Apr 18, 2006·8 cites·12 claims
- 2160US2009236013A1Method for increasing the effectiveness of a component of a materialSENJU METAL INDUSTRY CO·Filed 2009·Application pending·0 cites
- 2259US8865062B2High-temperature lead-free solder alloyUESHIMA MINORU·Filed 2012·Granted Oct 21, 2014·1 cites·17 claims
- 2358US10090268B2Method of forming solder bump, and solder bumpMURATA MANUFACTURING CO·Filed 2015·Granted Oct 2, 2018·1 cites·16 claims
- 2456US8975757B2Lead-free solder connection structure and solder ballUESHIMA MINORU·Filed 2009·Granted Mar 10, 2015·1 cites·20 claims
- 2555US10658107B2Method of manufacturing permanent magnetSENJU METAL INDUSTRY CO·Filed 2017·Granted May 19, 2020·0 cites·3 claims
- 2655US10265807B2Solder alloy and moduleSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 23, 2019·0 cites·7 claims
- 2752US9487846B2Electroconductive bonding materialSENJU METAL INDUSTRY CO·Filed 2013·Granted Nov 8, 2016·0 cites·8 claims
- 2852US7537728B2Method for increasing the effectiveness of a component of a materialSENJU METAL INDUSTRY CO·Filed 2004·Granted May 26, 2009·0 cites·18 claims
- 2950US9227258B2Lead-free solder alloy having reduced shrinkage cavitiesKAWAMATA YUJI·Filed 2009·Granted Jan 5, 2016·1 cites·14 claims
- 3048US8790472B2Process for producing a solder preform having high-melting metal particles dispersed thereinUESHIMA MINORU·Filed 2005·Granted Jul 29, 2014·0 cites·11 claims
- 3147US7628308B2Method of replenishing an oxidation suppressing element in a solder bathSENJU METAL INDUSTRY CO·Filed 2003·Granted Dec 8, 2009·5 cites·7 claims
- 3246US10968932B2Soldered joint and method for forming soldered jointSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 6, 2021·0 cites·13 claims
- 3346US10354944B2Method for soldering surface-mount component and surface-mount componentUESHIMA MINORU·Filed 2010·Granted Jul 16, 2019·0 cites·4 claims
- 3446US9205513B2Bi—Sn based high-temperature solder alloyUESHIMA MINORU·Filed 2011·Granted Dec 8, 2015·0 cites·10 claims
- 3546US2014112710A1Solder Alloy for Power Devices and Solder Joint Having a High Current DensityALBRECHT HANS-JURGEN·Filed 2012·Application pending·0 cites
- 3642US7451805B2Pouring apparatus for molten metal and casting methodSENJU METAL INDUSTRY CO·Filed 2005·Granted Nov 18, 2008·0 cites·7 claims
- 3741US2003021718A1Lead-free solder alloyFiled 2002·Application pending·0 cites
- 3840US2008246164A1Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic ComponentUESHIMA MINORU·Filed 2005·Application pending·0 cites
- 3939US11024598B2Metallic sintered bonding body and die bonding methodSENJU METAL INDUSTRY CO·Filed 2017·Granted Jun 1, 2021·0 cites·17 claims
- 4035US2014186208A1Audio solder alloyAKAGI IPPEI·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →