Inventor · disambiguated record

Tzu-Sheng Tseng

Also filed as: TSENG TZU-SHENG

1 granted patent·2 pending applications·18 citations·filing 2006–2023

38Inventor score

Technology areasH10W

Files withCHANG MING Y1 PHOENIX PREC TECHNOLOGY CORP1 TAIWAN SEMICONDUCTOR MFG CO LTD1

Top patents by PatentIndex Score

3 records

0183US7399399B2Method for manufacturing semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 15, 2008·18 cites·6 claims
0247US2025183140A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
0336US2007087587A1Method for manufacturing circuit board for semiconductor packageCHANG MING Y·Filed 2006·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →