Inventor · disambiguated record

Byungjoon Lee

Also filed as: LEE BYUNGJOON

1 granted patent·1 pending application·0 citations·filing 2017–2020

3Inventor score

Technology areasH10P Y02T

Files withMAZDA MOTOR OF AMERICA INC1 SAMSUNG ELECTRONICS CO LTD1

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2 records

0131US10784130B2Bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 22, 2020·0 cites·15 claims
0230US2021114477A1System and method for integrating a vehicle and a docking structure, and a vehicle thereforMAZDA MOTOR OF AMERICA INC·Filed 2020·Application pending·0 cites

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