Inventor · disambiguated record
Bao Le
Also filed as: LE BAO · LE BAO Q · LE BAO QUOC
16 granted patents·6 pending applications·504 citations·filing 1993–2021
95Inventor score
Files withPACKARD HUGHES INTERCONNECT CO8DELPHI TECH INC6APTIV TECH LTD2CHEVRON USA INC2DELPHI TECH LLC2
Top patents by PatentIndex Score
22 records- 0193US5790377AIntegral copper column with solder bump flip chipPACKARD HUGHES INTERCONNECT CO·Filed 1996·Granted Aug 4, 1998·151 cites·7 claims
- 0286US10396485B1Electrical connector assemblyDELPHI TECH LLC·Filed 2018·Granted Aug 27, 2019·10 cites·16 claims
- 0384US6617510B2Stress relief bend useful in an integrated circuit redistribution patchDELPHI TECH INC·Filed 2001·Granted Sep 9, 2003·31 cites·8 claims
- 0484US5855063AMethod of making contact pad having metallically anchored elastomeric electrical contactsPACKARD HUGHES INTERCONNECT CO·Filed 1997·Granted Jan 5, 1999·49 cites·6 claims
- 0582US10213772B2Middle distillate hydrocracking catalyst containing zeolite USY with enhanced acid sitesZHANG YIHUA·Filed 2015·Granted Feb 26, 2019·2 cites·19 claims
- 0679US10644421B2Electrical connector with dielectric properties suitable for high speed data transmissionAPTIV TECH LTD·Filed 2018·Granted May 5, 2020·5 cites·17 claims
- 0774US5657207AAlignment means for integrated circuit chipsPACKARD HUGHES INTERCONNECT CO·Filed 1996·Granted Aug 12, 1997·55 cites·4 claims
- 0874US5435733AConnector assembly for microelectronic multi-chip-moduleHUGHES AIRCRAFT CO·Filed 1993·Granted Jul 25, 1995·38 cites·20 claims
- 0973US7504839B2Flexible circuit with micro-sized probe tips and a method of making the sameDELPHI TECH INC·Filed 2004·Granted Mar 17, 2009·18 cites·11 claims
- 1070US5738530AContact pad having metallically anchored elastomeric electrical contactsPACKARD HUGHES INTERCONNECT CO·Filed 1996·Granted Apr 14, 1998·30 cites·4 claims
- 1169US6313402B1Stress relief bend useful in an integrated circuit redistribution patchPACKARD HUGHES INTERCONNECT CO·Filed 1997·Granted Nov 6, 2001·34 cites·13 claims
- 1262US5856641ASwitch having raised contact features and a deflectable substratePACKARD HUGHES INTERCONNECT CO·Filed 1998·Granted Jan 5, 1999·19 cites·25 claims
- 1360US6085414AMethod of making a flexible circuit with raised features protruding from two surfaces and products therefromPACKARD HUGHES INTERCONNECT CO·Filed 1998·Granted Jul 11, 2000·28 cites·7 claims
- 1454US5708557APuncture-resistant electrostatic chuck with flat surface and method of making the samePACKARD HUGHES INTERCONNECT CO·Filed 1996·Granted Jan 13, 1998·23 cites·9 claims
- 1551US11435530B2Dynamic contact and fiber optic termini cavity to wire removable sealsAPTIV TECH LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1650US2023001383A1Silica-Alumina Composite Materials for Hydroprocessing ApplicationsCHEVRON USA INC·Filed 2020·Application pending·0 cites
- 1750US2023330641A1Trimetal supported catalystCHEVRON USA INC·Filed 2021·Application pending·0 cites
- 1844US2019319436A1Method of manufacturing an electrical assembly by overprinting material using an additive manufacturing processDELPHI TECH LLC·Filed 2018·Application pending·0 cites
- 1943US6449840B1Column grid array for flip-chip devicesDELPHI TECH INC·Filed 1998·Granted Sep 17, 2002·11 cites·8 claims
- 2035US2014238741A1Hermetically sealed wire connector assembly and method of making sameDELPHI TECH INC·Filed 2014·Application pending·0 cites
- 2134US2013140082A1Wire connector assembly including splice elements for fluid environments and method of making sameDELPHI TECH INC·Filed 2013·Application pending·0 cites
- 2233US2013032395A1Wire connector assembly including splice elements for fluid environments and methods of making sameDELPHI TECH INC·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →