Inventor · disambiguated record
Yoshikazu Kumagaya
Also filed as: KUMAGAYA YOSHIKAZU
16 granted patents·3 pending applications·144 citations·filing 1998–2017
93Inventor score
Top patents by PatentIndex Score
19 records- 0189US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0286US10236231B2Semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Mar 19, 2019·5 cites·13 claims
- 0386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0478US8810043B2Semiconductor deviceNISHIMURA TAKAO·Filed 2011·Granted Aug 19, 2014·4 cites·9 claims
- 0576US8076785B2Semiconductor deviceNISHIMURA TAKAO·Filed 2006·Granted Dec 13, 2011·6 cites·1 claims
- 0676US6291895B1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 1999·Granted Sep 18, 2001·40 cites·5 claims
- 0766US6281571B1Semiconductor device having an external connection electrode extending through a through hole formed in a substrateFUJITSU LTD·Filed 2000·Granted Aug 28, 2001·13 cites·18 claims
- 0865US7973404B2Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jul 5, 2011·3 cites·14 claims
- 0964US6457633B1Method of forming a BGA-type semiconductor device having reliable electrical connection for solder ballsFUJITSU LTD·Filed 1999·Granted Oct 1, 2002·34 cites·4 claims
- 1062US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 1161US8076769B2Semiconductor device and manufacturing method of semiconductor deviceNISHIMURA TAKAO·Filed 2008·Granted Dec 13, 2011·1 cites·15 claims
- 1257US8659168B2Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring boardNISHIMURA TAKAO·Filed 2008·Granted Feb 25, 2014·1 cites·14 claims
- 1357US5953592AMethod of fabricating semiconductor having through holeFUJITSU LTD·Filed 1998·Granted Sep 14, 1999·18 cites·8 claims
- 1455US6869819B2Recognition method of a mark provided on a semiconductor deviceFUJITSU LTD·Filed 2002·Granted Mar 22, 2005·4 cites·10 claims
- 1550US10134710B2Semiconductor packageJ DEVICES CORP·Filed 2017·Granted Nov 20, 2018·0 cites·5 claims
- 1647US9601450B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Mar 21, 2017·0 cites·15 claims
- 1743US2015243576A1Semiconductor deviceJ DEVICES CORP·Filed 2015·Application pending·0 cites
- 1842US2014061887A1Semiconductor device and manufacturing method of semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 1937US2001028101A1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 2001·Application pending·0 cites
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