Inventor · disambiguated record
Hiroyuki Fukasawa
Also filed as: FUKASAWA HIROYUKI
15 granted patents·2 pending applications·303 citations·filing 1991–2022
93Inventor score
Top patents by PatentIndex Score
17 records- 0191US5844782APrinted wiring board and electronic device using sameSONY CORP·Filed 1996·Granted Dec 1, 1998·133 cites·6 claims
- 0289US7728343B2Light source apparatus and display apparatus and white resist layerSONY CORP·Filed 2006·Granted Jun 1, 2010·20 cites·28 claims
- 0382US8654810B2Light-emitting device and method of manufacturing the sameFUKASAWA HIROYUKI·Filed 2010·Granted Feb 18, 2014·9 cites·12 claims
- 0482US7878680B2Light source module, light source apparatus and liquid crystal displaySONY CORP·Filed 2007·Granted Feb 1, 2011·11 cites·23 claims
- 0577US6992395B2Semiconductor device and semiconductor module having external electrodes on an outer peripherySONY CORP·Filed 2002·Granted Jan 31, 2006·25 cites·3 claims
- 0673US8158997B2Optical element package and method of manufacturing the sameFUKASAWA HIROYUKI·Filed 2010·Granted Apr 17, 2012·3 cites·4 claims
- 0769US5214846APackaging of semiconductor chipsSONY CORP·Filed 1991·Granted Jun 1, 1993·27 cites·7 claims
- 0866US5932030AFlux for soldering using solder preformsSONY CORP·Filed 1996·Granted Aug 3, 1999·23 cites·7 claims
- 0962US5973931APrinted wiring board and electronic device using sameSONY CORP·Filed 1998·Granted Oct 26, 1999·27 cites·2 claims
- 1055US2022356107A1Method for producing glass filamentSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1150US8962355B2Optical element package and method of manufacturing the sameFUKASAWA HIROYUKI·Filed 2012·Granted Feb 24, 2015·0 cites·9 claims
- 1246US5650177AResin molding apparatusSONY CORP·Filed 1995·Granted Jul 22, 1997·10 cites·6 claims
- 1343US8619825B2Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the sameFUKASAWA HIROYUKI·Filed 2010·Granted Dec 31, 2013·0 cites·11 claims
- 1441US5289033APackaging of semiconductor chips with resinSONY CORP·Filed 1991·Granted Feb 22, 1994·11 cites·5 claims
- 1535US5882692AResin molding apparatusSONY CORP·Filed 1997·Granted Mar 16, 1999·4 cites·8 claims
- 1635US2002109216A1Integrated electronic device and integration methodFiled 2001·Application pending·0 cites
- 1730US5268532ASemiconductor deviceSONY CORP·Filed 1992·Granted Dec 7, 1993·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →