Inventor · disambiguated record
Daisuke Hirokane
Also filed as: HIROKANE DAISUKE
3 granted patents·0 citations·filing 2005–2010
38Inventor score
Top patents by PatentIndex Score
3 records- 0129US7723856B2Epoxy resin composition for the encapsulation of semiconductors and semiconductor devicesSUMITOMO BAKELITE CO·Filed 2005·Granted May 25, 2010·0 cites·8 claims
- 0228US8888477B2Molded product production deviceHIROKANE DAISUKE·Filed 2010·Granted Nov 18, 2014·0 cites·18 claims
- 0326US8876510B2Molded body production device, molded body production method, and molded bodyHIROKANE DAISUKE·Filed 2010·Granted Nov 4, 2014·0 cites·10 claims
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