Inventor · disambiguated record
Yuichi Sakaki
Also filed as: SAKAKI YUICHI
1 granted patent·1 pending application·5 citations·filing 2004–2007
27Inventor score
Files withTOPPAN PRINTING CO LTD2
Top patents by PatentIndex Score
2 records- 0169US7584535B2Method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2007·Granted Sep 8, 2009·5 cites·17 claims
- 0236US2004178492A1Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →