Inventor · disambiguated record
Norman L. Owens
Also filed as: OWENS NORMAN L · OWENS NORMAN LEE
13 granted patents·2 pending applications·226 citations·filing 1988–2017
93Inventor score
Top patents by PatentIndex Score
15 records- 0194USD345731SSemiconductor packageMOTOROLA INC·Filed 1992·Granted Apr 5, 1994·52 cites·1 claims
- 0286US6710265B2Multi-strand substrate for ball-grid array assemblies and methodMOTOROLA INC·Filed 2002·Granted Mar 23, 2004·32 cites·4 claims
- 0378US7074647B2Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each otherFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 11, 2006·26 cites·15 claims
- 0477US9466413B2Die-to-die inductive communication devices and methodsBRAUCHLER FRED T·Filed 2013·Granted Oct 11, 2016·5 cites·15 claims
- 0572USD462661SProgrammable electrical outletFiled 2001·Granted Sep 10, 2002·19 cites·1 claims
- 0668US6465743B1Multi-strand substrate for ball-grid array assemblies and methodMOTOROLA INC·Filed 1994·Granted Oct 15, 2002·26 cites·8 claims
- 0765US7199306B2Multi-strand substrate for ball-grid array assemblies and methodFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Apr 3, 2007·8 cites·30 claims
- 0864US6651666B1Variable cuff pressure adapterFiled 2002·Granted Nov 25, 2003·33 cites·3 claims
- 0958US7114367B1Pulmonary function test calibration system and methodOWENS NORMAN L·Filed 2004·Granted Oct 3, 2006·11 cites·9 claims
- 1054US2008289867A1Multi-strand substrate for ball-grid array assemblies and methodFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1142US2015004902A1Die-to-die inductive communication devices and methodsPIGOTT JOHN M·Filed 2013·Application pending·0 cites
- 1239US4816896ACompliant standoff for semiconductor packagesMOTOROLA INC·Filed 1988·Granted Mar 28, 1989·9 cites·20 claims
- 1337US10134660B2Semiconductor device having corrugated leads and method for formingNXP USA INC·Filed 2017·Granted Nov 20, 2018·0 cites·21 claims
- 1430USD455404SFlexible cordFiled 2001·Granted Apr 9, 2002·4 cites·1 claims
- 1529US4918512ASemiconductor package having an outwardly arced die cavityMOTOROLA INC·Filed 1988·Granted Apr 17, 1990·1 cites·10 claims
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