Inventor · disambiguated record
Toshitada Netsu
Also filed as: NETSU TOSHITADA
6 granted patents·222 citations·filing 1990–2003
86Inventor score
Technology areasH10W
Files withHITACHI LTD6
Top patents by PatentIndex Score
6 records- 0191US6528878B1Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2000·Granted Mar 4, 2003·72 cites·11 claims
- 0284US6272020B1Structure for mounting a semiconductor device and a capacitor device on a substrateHITACHI LTD·Filed 1998·Granted Aug 7, 2001·82 cites·2 claims
- 0381US6890799B2Device for sealing and cooling multi-chip modulesHITACHI LTD·Filed 2003·Granted May 10, 2005·30 cites·10 claims
- 0466US7518233B1Sealing structure for multi-chip moduleHITACHI LTD·Filed 2000·Granted Apr 14, 2009·16 cites·4 claims
- 0545US5136360AElectronic circuit device, method of connecting with solder and solder for connecting gold-plated terminalsHITACHI LTD·Filed 1990·Granted Aug 4, 1992·14 cites·1 claims
- 0636US5151773AElectronic circuit apparatus comprising a structure for sealing an electronic circuitHITACHI LTD·Filed 1991·Granted Sep 29, 1992·8 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →