Inventor · disambiguated record
Masanobu Kohara
Also filed as: KOHARA MASANOBU
14 granted patents·910 citations·filing 1983–2003
95Inventor score
Top patents by PatentIndex Score
14 records- 0197US4561011ADimensionally stable semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Dec 24, 1985·136 cites·5 claims
- 0296US5018003ALead frame and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted May 21, 1991·218 cites·2 claims
- 0396US4961052AProbing plate for wafer testingMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 2, 1990·141 cites·8 claims
- 0491US4937656ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 26, 1990·101 cites·11 claims
- 0588US5055780AProbe plate used for testing a semiconductor device, and a test apparatus thereforMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Oct 8, 1991·72 cites·7 claims
- 0679US4654966AMethod of making a dimensionally stable semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Apr 7, 1987·48 cites·6 claims
- 0777US5091772ASemiconductor device and packageMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Feb 25, 1992·49 cites·18 claims
- 0872US4799093ASemiconductor memory device having a mos transistor and superposed capacitorMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Jan 17, 1989·21 cites·5 claims
- 0964US6869865B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Mar 22, 2005·9 cites·19 claims
- 1063US5096853AMethod for manufacturing a resin encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Mar 17, 1992·29 cites·1 claims
- 1159US5290971APrinted circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Mar 1, 1994·28 cites·13 claims
- 1257US4907061AElectronic deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Mar 6, 1990·23 cites·5 claims
- 1353US5773879ACu/Mo/Cu clad mounting for high frequency devicesMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 30, 1998·27 cites·1 claims
- 1434US5175399AWiring panel including wiring having a surface-reforming layer and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 29, 1992·8 cites·16 claims
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