Inventor · disambiguated record

Hirofumi Watani

Also filed as: WATANI HIROFUMI

1 granted patent·29 citations·filing 2005–2005

44Inventor score

Technology areasH10W

Files withFUJITSU LTD1

Top patents by PatentIndex Score

1 record

0190US7416985B2Semiconductor device having a multilayer interconnection structure and fabrication method thereofFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·29 cites·10 claims

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