Inventor · disambiguated record
Donald V. Perino
Also filed as: DILLON NANCY DAVID · PERINO DONALD · PERINO DONALD V · PERINO DONALD VICTOR
50 granted patents·1 pending application·3,938 citations·filing 1996–2009
99Inventor score
Top patents by PatentIndex Score
51 records- 0199US6376904B1Redistributed bond pads in stacked integrated circuit die packageRAMBUS INC·Filed 2000·Granted Apr 23, 2002·339 cites·17 claims
- 0299US5908333AConnector with integral transmission line busRAMBUS INC·Filed 1997·Granted Jun 1, 1999·222 cites·17 claims
- 0398US7099424B1Clock data recovery with selectable phase controlRAMBUS INC·Filed 2001·Granted Aug 29, 2006·118 cites·31 claims
- 0498US6621155B1Integrated circuit device having stacked dies and impedance balanced transmission linesRAMBUS INC·Filed 1999·Granted Sep 16, 2003·316 cites·18 claims
- 0598US6266730B1High-frequency bus systemRAMBUS INC·Filed 2000·Granted Jul 24, 2001·137 cites·20 claims
- 0698US6234820B1Method and apparatus for joining printed circuit boardsRAMBUS INC·Filed 1997·Granted May 22, 2001·193 cites·16 claims
- 0797US6504875B2Apparatus for multilevel signalingRAMBUS INC·Filed 2001·Granted Jan 7, 2003·157 cites·30 claims
- 0897US6067594AHigh frequency bus systemRAMBUS INC·Filed 1997·Granted May 23, 2000·125 cites·8 claims
- 0997US6007357AChip socket assembly and chip file assembly for semiconductor chipsRAMBUS INC·Filed 1997·Granted Dec 28, 1999·113 cites·55 claims
- 1096US6882315B2Object location system and methodMULTISPECTRAL SOLUTIONS INC·Filed 2001·Granted Apr 19, 2005·195 cites·65 claims
- 1196US6619973B2Chip socket assembly and chip file assembly for semiconductor chipsRAMBUS INC·Filed 2001·Granted Sep 16, 2003·70 cites·4 claims
- 1296US6545875B1Multiple channel modules and bus systems using sameRAMBUS INC·Filed 2000·Granted Apr 8, 2003·75 cites·29 claims
- 1396US6514794B2Redistributed bond pads in stacked integrated circuit die packageRAMBUS INC·Filed 2002·Granted Feb 4, 2003·108 cites·18 claims
- 1495US7130944B2Chip-to-chip communication system using an ac-coupled bus and devices employed in sameRAMBUS INC·Filed 2004·Granted Oct 31, 2006·77 cites·26 claims
- 1595US6854030B2Integrated circuit device having a capacitive coupling elementRAMBUS INC·Filed 2002·Granted Feb 8, 2005·95 cites·10 claims
- 1695US6657871B2Multiple channel modules and bus systems using sameRAMBUS INC·Filed 2002·Granted Dec 2, 2003·53 cites·15 claims
- 1795US6530062B1Active impedance compensationRAMBUS INC·Filed 2000·Granted Mar 4, 2003·109 cites·30 claims
- 1895US6005895AApparatus and method for multilevel signalingRAMBUS INC·Filed 1996·Granted Dec 21, 1999·267 cites·23 claims
- 1994US6621373B1Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital systemRAMBUS INC·Filed 2000·Granted Sep 16, 2003·42 cites·12 claims
- 2094US6359931B1Apparatus and method for multilevel signalingRAMBUS INC·Filed 1999·Granted Mar 19, 2002·253 cites·17 claims
- 2192US6657468B1Apparatus and method for controlling edge rates of digital signalsRAMBUS INC·Filed 1999·Granted Dec 2, 2003·78 cites·21 claims
- 2291US6426984B1Apparatus and method for reducing clock signal phase skew in a master-slave system with multiple latent clock cyclesRAMBUS INC·Filed 1999·Granted Jul 30, 2002·82 cites·27 claims
- 2391US6273759B1Multi-slot connector with integrated bus providing contact between adjacent modulesRAMBUS INC·Filed 2000·Granted Aug 14, 2001·59 cites·15 claims
- 2491US6002589AIntegrated circuit package for coupling to a printed circuit boardRAMBUS INC·Filed 1997·Granted Dec 14, 1999·106 cites·71 claims
- 2590US6404660B1Semiconductor package with a controlled impedance bus and method of forming sameRAMBUS INC·Filed 1999·Granted Jun 11, 2002·50 cites·37 claims
- 2689US6687780B1Expandable slave device systemRAMBUS INC·Filed 2000·Granted Feb 3, 2004·47 cites·37 claims
- 2789US6496889B1Chip-to-chip communication system using an ac-coupled bus and devices employed in sameRAMBUS INC·Filed 1999·Granted Dec 17, 2002·81 cites·28 claims
- 2888US7627043B2Method and apparatus for transmitting data with reduced coupling noiseRAMBUS INC·Filed 2005·Granted Dec 1, 2009·13 cites·32 claims
- 2985USRE43720EIntegrated circuit device having stacked dies and impedance balanced transmission linesPERINO DONALD V·Filed 2005·Granted Oct 9, 2012·13 cites·101 claims
- 3085US6687319B1Spread spectrum clocking of digital signalsRAMBUS INC·Filed 1999·Granted Feb 3, 2004·82 cites·29 claims
- 3183US6287132B1Connector with staggered contact designRAMBUS INC·Filed 2000·Granted Sep 11, 2001·29 cites·10 claims
- 3282US5995016AMethod and apparatus for N choose M device selectionRAMBUS INC·Filed 1996·Granted Nov 30, 1999·100 cites·27 claims
- 3380US7626248B2Semiconductor package with a controlled impedance busRAMBUS INC·Filed 2006·Granted Dec 1, 2009·5 cites·9 claims
- 3474US6589059B2Chip socket assembly and chip file assembly for semiconductor chipsRAMBUS INC·Filed 2001·Granted Jul 8, 2003·15 cites·22 claims
- 3573US6968024B1Apparatus and method for operating a master-slave system with a clock signal and a separate phase signalRAMBUS INC·Filed 2000·Granted Nov 22, 2005·20 cites·31 claims
- 3672US7536494B2Expandable slave device system with buffered subsystemsRAMBUS INC·Filed 2007·Granted May 19, 2009·4 cites·29 claims
- 3767US6714431B2Semiconductor package with a controlled impedance bus and method of forming sameRAMBUS INC·Filed 2003·Granted Mar 30, 2004·7 cites·40 claims
- 3867US6447321B1Socket for coupling an integrated circuit package to a printed circuit boardRAMBUS INC·Filed 1999·Granted Sep 10, 2002·28 cites·18 claims
- 3961US7222209B2Expandable slave device systemRAMBUS INC·Filed 2003·Granted May 22, 2007·6 cites·6 claims
- 4060US8096812B2Chip socket assembly and chip file assembly for semiconductor chipsPERINO DONALD V·Filed 2005·Granted Jan 17, 2012·6 cites·57 claims
- 4160US8036284B2Method and apparatus for transmitting data with reduced coupling noiseRAMBUS INC·Filed 2009·Granted Oct 11, 2011·1 cites·19 claims
- 4259US7134101B2Active impedance compensationRAMBUS INC·Filed 2003·Granted Nov 7, 2006·5 cites·22 claims
- 4357US6352435B1Chip socket assembly and chip file assembly for semiconductor chipsRAMBUS INC·Filed 1999·Granted Mar 5, 2002·12 cites·13 claims
- 4455US6160716AMotherboard having one-between trace connections for connectorsRAMBUS INC·Filed 1999·Granted Dec 12, 2000·13 cites·9 claims
- 4554US8076759B2Semiconductor package with a controlled impedance bus and method of forming sameGAMINI NADER·Filed 2009·Granted Dec 13, 2011·0 cites·20 claims
- 4652USRE39153EConnector with integral transmission line busRAMBUS INC·Filed 2001·Granted Jul 4, 2006·6 cites·57 claims
- 4752US6999332B2Semiconductor package with a controlled impedance bus and method of forming sameRAMBUS INC·Filed 2003·Granted Feb 14, 2006·2 cites·14 claims
- 4841US6731545B2Method and apparatus for reducing worst case powerRAMBUS INC·Filed 2001·Granted May 4, 2004·1 cites·35 claims
- 4941US6583035B2Semiconductor package with a controlled impedance bus and method of forming sameRAMBUS INC·Filed 2002·Granted Jun 24, 2003·0 cites·29 claims
- 5041US2002055285A1Chip socket assembly and chip file assembly for semiconductor chipsRAMBUS INC·Filed 2001·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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