Inventor · disambiguated record

Daiki Sugiyama

Also filed as: SUGIYAMA DAIKI

1 granted patent·3 pending applications·10 citations·filing 2001–2025

32Inventor score

Technology areasB41J C08G G06Q H10W

Files withMITSUBISHI CHEM CORP2 ALPS ELECTRIC CO LTD1 OMRON TATEISI ELECTRONICS CO1

Top patents by PatentIndex Score

4 records

0162US2024368336A1Modified epoxy resin, curable resin composition, and cured product thereofMITSUBISHI CHEM CORP·Filed 2024·Application pending·0 cites
0261US6501497B2Thermal head with small size of steps of protective layer formed on heating portion and manufacturing method thereofALPS ELECTRIC CO LTD·Filed 2001·Granted Dec 31, 2002·10 cites·5 claims
0353US2023229137A1Analysis device, analysis method and non-transitory computer-readable storage mediumOMRON TATEISI ELECTRONICS CO·Filed 2022·Application pending·0 cites
0445US2025368773A1Epoxy resin, production method for same, curable resin composition, and cured productMITSUBISHI CHEM CORP·Filed 2025·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →