Inventor · disambiguated record

Ken Qian

Also filed as: QIAN KEN

1 granted patent·2 citations·filing 2017–2017

18Inventor score

Technology areasH10W

Files withSANDISK INFORMATION TECH SHANGHAI CO LTD1

Top patents by PatentIndex Score

1 record

0165US11031371B2Semiconductor package and method of fabricating semiconductor packageSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Jun 8, 2021·2 cites·17 claims

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