Inventor · disambiguated record
Wen-Jeng Lin
Also filed as: LIN WEN-JENG
19 granted patents·3 pending applications·275 citations·filing 1995–2022
94Inventor score
Files withUNITED MICROELECTRONICS CORP12IND TECH RES INST4LIN WEN JENG1MOSEL VITELIC INC1UNITED MICROELECTRIC CORP1
Top patents by PatentIndex Score
22 records- 0188US5519108ACatalytic compositions containing tetrabutyl titanate and a mixture of cocatalysts for the preparation of poly(butylene terephthalate)IND TECH RES INST·Filed 1995·Granted May 21, 1996·74 cites·17 claims
- 0274US5516879ACatalytic compositions for the preparation of poly(butylene terephthalate)IND TECH RES INST·Filed 1995·Granted May 14, 1996·27 cites·15 claims
- 0368US5946568ASelf aligned method of fabricating a DRAM with improved capacitanceMOSEL VITELIC INC·Filed 1996·Granted Aug 31, 1999·38 cites·8 claims
- 0467US5891987ACopolyamide composition with a high glass transition temperatureIND TECH RES INST·Filed 1995·Granted Apr 6, 1999·21 cites·8 claims
- 0565US6689673B1Method for forming a gate with metal silicideUNITED MICROELECTRONICS CORP·Filed 2000·Granted Feb 10, 2004·12 cites·12 claims
- 0663US6180514B1Method for forming interconnect using dual damasceneFiled 1999·Granted Jan 30, 2001·29 cites·14 claims
- 0755US6218239B1Manufacturing method of a bottom plateUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 17, 2001·17 cites·10 claims
- 0849US2022373094A1Pressure resistance valve structureLIN WEN JENG·Filed 2022·Application pending·0 cites
- 0948US7638390B2Manufacturing method of static random access memoryUNITED MICROELECTRIC CORP·Filed 2007·Granted Dec 29, 2009·2 cites·2 claims
- 1047US6221767B1Method of fabricating a silicide landing padUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 24, 2001·11 cites·14 claims
- 1143US6306760B1Method of forming a self-aligned contact hole on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Oct 23, 2001·16 cites·17 claims
- 1241US6281134B1Method for combining logic circuit and capacitorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 28, 2001·9 cites·25 claims
- 1340US6177297B1Method of forming metallic fuse demanding lower laser power for circuit repairUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 23, 2001·9 cites·13 claims
- 1439US2005156252A1Method for forming a polycide gate and structure of the sameUNITED MICROELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 1537US2004166687A1Method for forming a polycide gate and structure of the sameFiled 2003·Application pending·0 cites
- 1636US7358556B2SRAM cell structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2006·Granted Apr 15, 2008·0 cites·5 claims
- 1736US7309890B2SRAM cell structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 18, 2007·0 cites·3 claims
- 1836US6238958B1Method for forming a transistor with reduced source/drain series resistanceUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·5 cites·20 claims
- 1934US7144777B2Non-volatile memory and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2005·Granted Dec 5, 2006·0 cites·15 claims
- 2034US5760167ACopolyamide composition with a high glass transition temperature and a low melting pointIND TECH RES INST·Filed 1995·Granted Jun 2, 1998·5 cites·7 claims
- 2132US7157763B2SRAM cell structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 2, 2007·0 cites·4 claims
- 2230US7449741B2SRAM cell structure and manufacturing method thereofUNITED MICROELETRONIC CORP·Filed 2006·Granted Nov 11, 2008·0 cites·3 claims
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