Inventor · disambiguated record
Tzung-Han Lee
Also filed as: LEE TZUNG-HAN
108 granted patents·37 pending applications·763 citations·filing 1997–2024
99Inventor score
Files withUNITED MICROELECTRONICS CORP41INOTERA MEMORIES INC29LEE TZUNG-HAN23CHANGXIN MEMORY TECH INC18ZIPPY TECH CORP10
Top patents by PatentIndex Score
145 records- 0193US9018733B1Capacitor, storage node of the capacitor, and method of forming the sameINOTERA MEMORIES INC·Filed 2014·Granted Apr 28, 2015·15 cites·11 claims
- 0292US7200004B2Loading and unloading mechanism for removable power supply modulesZIPPY TECH CORP·Filed 2005·Granted Apr 3, 2007·33 cites·8 claims
- 0391US9735119B1Conductive pads forming methodMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 15, 2017·7 cites·16 claims
- 0491US9171847B1Semiconductor structureINOTERA MEMORIES INC·Filed 2014·Granted Oct 27, 2015·11 cites·10 claims
- 0587US9466713B2Non-floating vertical transistor structureINOTERA MEMORIES INC·Filed 2015·Granted Oct 11, 2016·5 cites·21 claims
- 0687US7633109B2DRAM structure and method of making the sameNANYA TECHNOLOGY CORP·Filed 2007·Granted Dec 15, 2009·17 cites·6 claims
- 0782US9257553B2Vertical transistor and method to form vertical transistor contact nodeINOTERA MEMORIES INC·Filed 2014·Granted Feb 9, 2016·5 cites·19 claims
- 0878US9299710B2Manufacturing method of capacitor lower electrode and semiconductor storage device using the sameINOTERA MEMORIES INC·Filed 2014·Granted Mar 29, 2016·5 cites·4 claims
- 0978US8431933B2Memory layout structure and memory structureLEE TZUNG-HAN·Filed 2010·Granted Apr 30, 2013·5 cites·9 claims
- 1078US7357708B2Anchor structure for fansZIPPY TECH CORP·Filed 2003·Granted Apr 15, 2008·21 cites·10 claims
- 1178US6171951B1Dual damascene method comprising ion implanting to densify dielectric layer and forming a hard mask layer with a tapered openingUNITED MICROELECTRONIC CORP·Filed 1998·Granted Jan 9, 2001·61 cites·20 claims
- 1277US7615443B2Method of forming finFET deviceNANYA TECHNOLOGY CORP·Filed 2008·Granted Nov 10, 2009·7 cites·6 claims
- 1376US8298892B1Fabricating method of insulatorLEE TZUNG-HAN·Filed 2011·Granted Oct 30, 2012·4 cites·8 claims
- 1476US7524205B1Conducting wire anti-drop structureZIPPY TECH CORP·Filed 2008·Granted Apr 28, 2009·14 cites·7 claims
- 1574US9312262B2Dynamic random access memory unit and fabrication method thereofINOTERA MEMORIES INC·Filed 2014·Granted Apr 12, 2016·3 cites·9 claims
- 1674US6801435B1Fixing structure for power suppliesZIPPY TECH CORP·Filed 2003·Granted Oct 5, 2004·18 cites·4 claims
- 1774US5933749AMethod for removing a top corner of a trenchUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 3, 1999·43 cites·11 claims
- 1873US8471664B1Transformer without coil racksHUANG YUNG-HSIN·Filed 2012·Granted Jun 25, 2013·4 cites·5 claims
- 1972US8288224B2Method for manufacturing capacitor lower electrodes of semiconductor memoryHUANG SHIN-BIN·Filed 2010·Granted Oct 16, 2012·4 cites·13 claims
- 2072USD488776SPower supplyZIPPY TECH CORP·Filed 2003·Granted Apr 20, 2004·18 cites·1 claims
- 2172US6361928B1Method of defining a mask pattern for a photoresist layer in semiconductor fabricationUNITED MICROELECTRONICS CORP·Filed 2000·Granted Mar 26, 2002·14 cites·10 claims
- 2271US6291281B1Method of fabricating protection structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 18, 2001·32 cites·15 claims
- 2371US5994201AMethod for manufacturing shallow trench isolation regionsUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 30, 1999·39 cites·20 claims
- 2470US6312985B1Method of fabricating a bottom electrodeUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 6, 2001·17 cites·20 claims
- 2570US6159797AMethod of fabricating a flash memory with a planarized topographyUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 12, 2000·29 cites·28 claims
- 2669US8455363B2Method for adjusting trench depth of substrateLEE TZUNG-HAN·Filed 2011·Granted Jun 4, 2013·2 cites·2 claims
- 2769US7960241B2Manufacturing method for double-side capacitor of stack DRAMINOTERA MEMORIES INC·Filed 2010·Granted Jun 14, 2011·3 cites·20 claims
- 2869US7586152B2Semiconductor structureNANYA TECHNOLOGY CORP·Filed 2007·Granted Sep 8, 2009·3 cites·7 claims
- 2969US7254020B2Fan assembly for a power supplyZIPPY TECH CORP·Filed 2004·Granted Aug 7, 2007·12 cites·14 claims
- 3067US6570246B1Multi-die packageUNITED MICROELECTRONICS CORP·Filed 2002·Granted May 27, 2003·13 cites·18 claims
- 3166US9070782B2Semiconductor structureINOTERA MEMORIES INC·Filed 2013·Granted Jun 30, 2015·2 cites·10 claims
- 3266US6261968B1Method of forming a self-aligned contact hole on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 17, 2001·10 cites·10 claims
- 3366US6146971AProcess for forming a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 14, 2000·16 cites·7 claims
- 3465US8471320B2Memory layout structureLEE TZUNG-HAN·Filed 2012·Granted Jun 25, 2013·2 cites·9 claims
- 3565US8455319B2Vertical transistor for random-access memory and manufacturing method thereofLEE TZUNG HAN·Filed 2011·Granted Jun 4, 2013·2 cites·10 claims
- 3664US9230967B2Method for forming self-aligned isolation trenches in semiconductor substrate and semiconductor deviceINOTERA MEMORIES INC·Filed 2014·Granted Jan 5, 2016·1 cites·3 claims
- 3764US8766759B2TransformerZIPPY TECH CORP·Filed 2012·Granted Jul 1, 2014·1 cites·7 claims
- 3863US9184166B2Manufacturing method of capacitor structure and semiconductor device using the sameINOTERA MEMORIES INC·Filed 2014·Granted Nov 10, 2015·1 cites·5 claims
- 3963US6235642B1Method for reducing plasma charging damagesUNITED MICROELECTRONICS CORP·Filed 2000·Granted May 22, 2001·11 cites·22 claims
- 4062US12159828B2Semiconductor structure with shielding structure for through silicon via and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 3, 2024·0 cites·19 claims
- 4162US9129849B2Stacked capacitor structure and a fabricating method for fabricating the sameINOTERA MEMORIES INC·Filed 2013·Granted Sep 8, 2015·1 cites·5 claims
- 4262US2025096162A1Semiconductor structure and manufacturing method thereforCXMT CORP·Filed 2024·Application pending·0 cites
- 4361US6100158AMethod of manufacturing an alignment mark with an etched back dielectric layer and a transparent dielectric layer and a device region on a higher plane with a wiring layer and an isolation regionUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 8, 2000·27 cites·13 claims
- 4461US6040241AMethod of avoiding sidewall residue in forming connectionsUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 21, 2000·20 cites·13 claims
- 4560US12408409B2Semiconductor structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2023·Granted Sep 2, 2025·0 cites·15 claims
- 4660US12334415B2Through vias with test structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 17, 2025·0 cites·15 claims
- 4760US8703562B2Manufacturing method of random access memoryLEE TZUNG-HAN·Filed 2012·Granted Apr 22, 2014·1 cites·10 claims
- 4860US8309998B2Memory structure having a floating body and method for fabricating the sameLEE TZUNG-HAN·Filed 2011·Granted Nov 13, 2012·1 cites·11 claims
- 4960US7382614B2Power supply having an extendable power input portZIPPY TECH CORP·Filed 2004·Granted Jun 3, 2008·6 cites·10 claims
- 5060US6465360B2Method for fabricating an ultra small openingUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 15, 2002·8 cites·27 claims
Showing the top 50 of 145 patent records by PatentIndex Score.
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