Inventor · disambiguated record
Rajwant Sidhu
Also filed as: SIDHU RAJWANT · SIDHU RAJWANT S · SIDHU RAJWANT SINGH
5 granted patents·1 pending application·6 citations·filing 2008–2015
68Inventor score
Top patents by PatentIndex Score
6 records- 0164US8156645B2Method of manufacturing a multilayer printed wiring board with copper wrap plated holeSIDHU RAJWANT SINGH·Filed 2008·Granted Apr 17, 2012·4 cites·5 claims
- 0253US8510941B2Methods of manufacturing a printed wiring board having copper wrap plated holeSIDHU RAJWANT SINGH·Filed 2012·Granted Aug 20, 2013·1 cites·21 claims
- 0351US9913382B2Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive capVIASYSTEMS TECH CORP L L C·Filed 2015·Granted Mar 6, 2018·1 cites·12 claims
- 0444US2013220675A1Method of manufacturing a printed circuit boardSIDHU RAJWANT·Filed 2012·Application pending·0 cites
- 0543US8250751B2Method of manufacturing a printed circuit boardSIDHU RAJWANT·Filed 2008·Granted Aug 28, 2012·0 cites·9 claims
- 0633US9017540B2Systems and methods for reducing overhang on electroplated surfaces of printed circuit boardsSIDHU RAJWANT S·Filed 2011·Granted Apr 28, 2015·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →