Inventor · disambiguated record

Si-Kua Cheng

Also filed as: CHENG SI-KUA

1 granted patent·0 citations·filing 2004–2004

11Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

1 record

0137US7122471B2Method for preventing voids in metal interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·0 cites·20 claims

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