Inventor · disambiguated record
Muthiah Venkateswaran
Also filed as: VENKATESWARAN MUTHIAH
5 granted patents·357 citations·filing 2002–2004
84Inventor score
Files withTEXAS INSTRUMENTS INC5
Top patents by PatentIndex Score
5 records- 0196US6888255B2Built-up bump pad structure and method for sameTEXAS INSTRUMENTS INC·Filed 2003·Granted May 3, 2005·144 cites·10 claims
- 0295US6849944B2Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die padTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 1, 2005·107 cites·37 claims
- 0392US6780673B2Method of forming a semiconductor device package using a plate layer surrounding contact padsTEXAS INSTRUMENTS INC·Filed 2002·Granted Aug 24, 2004·92 cites·16 claims
- 0465US7135765B2Semiconductor device package and method of making the sameTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 14, 2006·12 cites·11 claims
- 0544US7084011B2Forming a chip package having a no-flow underfillTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 1, 2006·2 cites·11 claims
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