Inventor · disambiguated record

Kean Huat Leong

Also filed as: LEONG KEAN HUAT

1 granted patent·1 pending application·1 citations·filing 2018–2023

16Inventor score

Technology areasH01L H05K

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0158US10636749B2Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling sameINTEL CORP·Filed 2018·Granted Apr 28, 2020·1 cites·18 claims
0236US2024260193A1Decoupling capacitor booster moduleINTEL CORP·Filed 2023·Application pending·0 cites

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