Inventor · disambiguated record
Peter Hartwell
Also filed as: HARTWELL PETER · HARTWELL PETER G · HARTWELL PETER GEORGE
50 granted patents·14 pending applications·889 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
64 records- 0198US6600201B2Systems with high density packing of micromachinesHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jul 29, 2003·224 cites·13 claims
- 0297US6798392B2Smart helmetHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 28, 2004·111 cites·25 claims
- 0396US6504385B2Three-axis motion sensorHEWLETT PAKCARD COMPANY·Filed 2001·Granted Jan 7, 2003·103 cites·20 claims
- 0495US11802041B2On-chip signal path with electrical and physical connectionINVENSENSE INC·Filed 2022·Granted Oct 31, 2023·2 cites·20 claims
- 0594US6509620B2Flexure coupling block for motion sensorHEWLETT PACKARD CO·Filed 2001·Granted Jan 21, 2003·54 cites·20 claims
- 0693US10598621B2Gas sensing device with chemical and thermal conductivity sensingINVENSENSE INC·Filed 2017·Granted Mar 24, 2020·8 cites·12 claims
- 0793US7342575B1Electronic writing systems and methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 11, 2008·92 cites·28 claims
- 0889US7042105B2Methods for dicing wafer stacks to provide access to interior structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted May 9, 2006·12 cites·17 claims
- 0988US11299393B2On-chip signal path with electrical and physical connectionINVENSENSE INC·Filed 2019·Granted Apr 12, 2022·3 cites·18 claims
- 1087US7115505B2Methods for electrically isolating portions of wafersHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 3, 2006·45 cites·14 claims
- 1187US2025388462A1Mems device with shelf and topside electrical connectionsINVENSENSE INC·Filed 2025·Application pending·0 cites
- 1284US11092616B2Method and device for band-pass sensor data acquisitionINVENSENSE INC·Filed 2018·Granted Aug 17, 2021·2 cites·7 claims
- 1384US10833698B1Low-power high-precision sensing circuitINVENSENSE INC·Filed 2019·Granted Nov 10, 2020·5 cites·31 claims
- 1482US6440820B1Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor waferHEWLETT PACKARD CO·Filed 2001·Granted Aug 27, 2002·16 cites·14 claims
- 1581US10935509B2Gas sensing method with chemical and thermal conductivity sensingINVENSENSE INC·Filed 2020·Granted Mar 2, 2021·1 cites·12 claims
- 1681US8272266B2Gyroscopes using surface electrodesZHANG WENHUA·Filed 2009·Granted Sep 25, 2012·19 cites·27 claims
- 1780US10200581B2Heads down intelligent display and processingHARTWELL PETER G·Filed 2017·Granted Feb 5, 2019·4 cites·13 claims
- 1880US9446941B2Method of lower profile MEMS package with stress isolationsAPPLE INC·Filed 2014·Granted Sep 20, 2016·3 cites·12 claims
- 1978US7808061B2Multi-die apparatus including moveable portionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Oct 5, 2010·3 cites·32 claims
- 2078US6955976B2Method for dicing wafer stacks to provide access to interior structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 18, 2005·19 cites·7 claims
- 2177US10351419B2Integrated package containing MEMS acoustic sensor and pressure sensorINVENSENSE INC·Filed 2016·Granted Jul 16, 2019·3 cites·19 claims
- 2277US6784630B2Use of standoffs to protect atomic resolution storage mover for out-of-plan motionHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Aug 31, 2004·15 cites·15 claims
- 2376US10891461B2Live fingerprint detection utilizing an integrated ultrasound and infrared sensorINVENSENSE INC·Filed 2017·Granted Jan 12, 2021·3 cites·28 claims
- 2476US9571008B2Out-of plane travel restriction structuresMILLIGAN DONALD J·Filed 2011·Granted Feb 14, 2017·5 cites·15 claims
- 2576US6930368B2MEMS having a three-wafer structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 16, 2005·33 cites·53 claims
- 2676US6621096B2Device isolation process flow for ARS systemHEWLETT PACKARD DEVELPOMENT CO·Filed 2001·Granted Sep 16, 2003·21 cites·8 claims
- 2775US9980069B2Acoustically configurable microphoneINVENSENSE INC·Filed 2016·Granted May 22, 2018·2 cites·23 claims
- 2875US6436794B1Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor waferHEWLETT PACKARD CO·Filed 2001·Granted Aug 20, 2002·18 cites·14 claims
- 2974US12415720B2MEMS electrical and physical connection via solder couplingsINVENSENSE INC·Filed 2022·Granted Sep 16, 2025·0 cites·22 claims
- 3074US9656856B2Method of lower profile MEMS package with stress isolationsAPPLE INC·Filed 2016·Granted May 23, 2017·1 cites·20 claims
- 3174US8030754B2Chip cooling channels formed in wafer bonding gapHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Granted Oct 4, 2011·6 cites·10 claims
- 3270US6784592B2Use of standoffs to protect atomic resolution storage mover for out-of-plane motionHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Aug 31, 2004·11 cites·12 claims
- 3369US6784593B2Use of standoffs to protect atomic resolution storage mover for out-of-plane motionHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Aug 31, 2004·10 cites·15 claims
- 3467US7618752B2Deformation-based contact lithography systems, apparatus and methodsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Nov 17, 2009·2 cites·22 claims
- 3566US8390444B2Sensor-location system for locating a sensor in a tract covered by an earth-based sensor networkLI ZHIYONG·Filed 2010·Granted Mar 5, 2013·3 cites·12 claims
- 3662US7391090B2Systems and methods for electrically coupling wires and conductorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jun 24, 2008·10 cites·51 claims
- 3759US6750516B2Systems and methods for electrically isolating portions of wafersHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jun 15, 2004·8 cites·24 claims
- 3856US2013329108A1Method And System For Processing An ImageHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Application pending·0 cites
- 3955US10383967B2Substance sensing with tracersINVENSENSE INC·Filed 2016·Granted Aug 20, 2019·0 cites·20 claims
- 4055US6664193B2Device isolation process flow for ARS systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Dec 16, 2003·5 cites·12 claims
- 4153US7966880B2Adjusting the damping level of an encapsulated deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Jun 28, 2011·1 cites·20 claims
- 4253US7503989B2Methods and systems for aligning and coupling devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 17, 2009·5 cites·25 claims
- 4352US11995909B2Multipath reflection correctionTDK CORP·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 4452US2006283465A1Smart drug delivery system and a method of implementation thereofNICKEL JANICE H·Filed 2005·Application pending·0 cites
- 4551US9752877B2Electronic device having electronic compass with demagnetizing coil and annular flux concentrating yokesAPPLE INC·Filed 2015·Granted Sep 5, 2017·0 cites·26 claims
- 4651US8049579B2Resonator having a stator coupled to three stator voltagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Nov 1, 2011·1 cites·15 claims
- 4750US12174295B2Acoustic multipath correctionTDK CORP·Filed 2021·Granted Dec 24, 2024·0 cites·19 claims
- 4849US8508643B2Method and system for processing an imageNICKEL JANICE H·Filed 2003·Granted Aug 13, 2013·0 cites·17 claims
- 4948US9522819B2Light detection system including a chiral optical element and optical elements with sub-wavelength gratings having posts with varying cross-sectional dimensionsFATTAL DAVID A·Filed 2011·Granted Dec 20, 2016·0 cites·13 claims
- 5046US2022043993A1Ultrasonic sensor with receive beamformingTDK CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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