Inventor · disambiguated record
Noboru Morimoto
Also filed as: MORIMOTO NOBORU
13 granted patents·2 pending applications·125 citations·filing 2000–2025
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0184US7884011B2Semiconductor device and method of manufacture thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 8, 2011·6 cites·2 claims
- 0283US7714413B2Semiconductor device and method of manufacture thereofRENESAS TECH CORP·Filed 2006·Granted May 11, 2010·10 cites·6 claims
- 0380US6734489B2Semiconductor element and MIM-type capacitor formed in different layers of a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted May 11, 2004·31 cites·20 claims
- 0479US6624516B2Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layerMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 23, 2003·25 cites·6 claims
- 0576US8169080B2Semiconductor device and method of manufacture thereofMORIMOTO NOBORU·Filed 2010·Granted May 1, 2012·5 cites·6 claims
- 0670US6664641B2Wiring structure for an integrated circuitMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 16, 2003·17 cites·5 claims
- 0768US8008730B2Semiconductor device, and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 30, 2011·4 cites·11 claims
- 0865US6780769B2Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layerRENESAS TECH CORP·Filed 2003·Granted Aug 24, 2004·11 cites·7 claims
- 0961US6399424B1Method of manufacturing contact structureMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jun 4, 2002·11 cites·15 claims
- 1060US10892363B2Semiconductor device having termination region with insulator films having different coefficients of moisture absorptionMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jan 12, 2021·0 cites·4 claims
- 1154US10686068B2Semiconductor device having termination region with insulator having low coefficient of moisture absorptionMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 16, 2020·0 cites·8 claims
- 1250US2025359100A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1349US6737319B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted May 18, 2004·3 cites·8 claims
- 1446US6509648B1Method of manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 21, 2003·2 cites·6 claims
- 1541US2006103025A1Semiconductor device including sealing ringRENESAS TECH CORP·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →