Inventor · disambiguated record
Toshimitsu Wakuda
Also filed as: WAKUDA TOSHIMITSU
26 granted patents·1 pending application·1,681 citations·filing 2003–2017
98Inventor score
Top patents by PatentIndex Score
27 records- 0199US8283595B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2009·Granted Oct 9, 2012·68 cites·59 claims
- 0299US7825350B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 2, 2010·126 cites·44 claims
- 0399US7732730B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 8, 2010·139 cites·7 claims
- 0499US7626137B2Laser cutting by forming a modified region within an object and generating fracturesHAMAMATSU PHOTONICS KK·Filed 2005·Granted Dec 1, 2009·130 cites·24 claims
- 0599US7615721B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Nov 10, 2009·118 cites·12 claims
- 0699US7592238B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Sep 22, 2009·123 cites·42 claims
- 0799US7547613B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jun 16, 2009·144 cites·12 claims
- 0899US7396742B2Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the objectHAMAMATSU PHOTONICS KK·Filed 2005·Granted Jul 8, 2008·167 cites·62 claims
- 0999US6992026B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2003·Granted Jan 31, 2006·447 cites·38 claims
- 1098US8227724B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2010·Granted Jul 24, 2012·31 cites·10 claims
- 1196US8927900B2Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 6, 2015·14 cites·5 claims
- 1296US8685838B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Apr 1, 2014·93 cites·9 claims
- 1395US9837315B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2014·Granted Dec 5, 2017·8 cites·7 claims
- 1495US8969761B2Method of cutting a wafer-like object and semiconductor chipFUKUYO FUMITSUGU·Filed 2010·Granted Mar 3, 2015·10 cites·47 claims
- 1594US8516852B2Glass fusion methodMATSUMOTO SATOSHI·Filed 2009·Granted Aug 27, 2013·18 cites·12 claims
- 1692US10796959B2Laser processing method and laser processing apparatusHAMAMATSU PHOTONICS KK·Filed 2017·Granted Oct 6, 2020·3 cites·7 claims
- 1788US8716110B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted May 6, 2014·3 cites·8 claims
- 1887US8946592B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 1987US8946591B2Method of manufacturing a semiconductor device formed using a substrate cutting methodFUKUYO FUMITSUGU·Filed 2012·Granted Feb 3, 2015·3 cites·5 claims
- 2085US8247734B2Laser beam machining methodFUKUYO FUMITSUGU·Filed 2003·Granted Aug 21, 2012·29 cites·9 claims
- 2178US8937264B2Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Granted Jan 20, 2015·1 cites·5 claims
- 2261US8946589B2Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Feb 3, 2015·0 cites·8 claims
- 2361US8933369B2Method of cutting a substrate and method of manufacturing a semiconductor deviceFUKUYO FUMITSUGU·Filed 2010·Granted Jan 13, 2015·0 cites·12 claims
- 2461US2012279947A1Laser processing method and laser processing apparatusFUKUYO FUMITSUGU·Filed 2012·Application pending·0 cites
- 2557US9181126B2Glass fusion methodMATSUMOTO SATOSHI·Filed 2012·Granted Nov 10, 2015·0 cites·2 claims
- 2656US10322469B2Fusion bonding process for glassMATSUMOTO SATOSHI·Filed 2009·Granted Jun 18, 2019·0 cites·18 claims
- 2750US7626746B2Shutter unit and laser processing device using sameHAMAMATSU PHOTONICS KK·Filed 2004·Granted Dec 1, 2009·3 cites·3 claims
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