Inventor · disambiguated record
Kishio Yokouchi
Also filed as: YOKOUCHI KISHIO
51 granted patents·5 pending applications·1,200 citations·filing 1981–2009
99Inventor score
Top patents by PatentIndex Score
56 records- 0197US4704658AEvaporation cooling module for semiconductor devicesFUJITSU LTD·Filed 1986·Granted Nov 3, 1987·122 cites·24 claims
- 0296US7092603B2Optical bridge for chip-to-board interconnection and methods of fabricationFUJITSU LTD·Filed 2004·Granted Aug 15, 2006·94 cites·27 claims
- 0395US6999238B2Tunable micro-lens arrayFUJITSU LTD·Filed 2003·Granted Feb 14, 2006·72 cites·28 claims
- 0495US5478972AMultilayer circuit board and a method for fabricating the sameFUJITSU LTD·Filed 1994·Granted Dec 26, 1995·111 cites·11 claims
- 0591US6001488AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Dec 14, 1999·58 cites·4 claims
- 0690US6504966B2Optical deflecting element, optical switch module, light signal switching deviceFUJITSU LTD·Filed 2002·Granted Jan 7, 2003·43 cites·19 claims
- 0790US6403289B1Developer for photosensitive polyimide resin compositionNIPPON ZEON CO·Filed 1998·Granted Jun 11, 2002·79 cites·23 claims
- 0888US7418165B2Flexible optical waveguides for backplane optical interconnectionsFUJITSU LTD·Filed 2005·Granted Aug 26, 2008·16 cites·6 claims
- 0988US7224881B2Variable optical attenuatorFUJITSU LTD·Filed 2005·Granted May 29, 2007·9 cites·4 claims
- 1085US7209621B2Optical apparatuses providing optical interconnections among a plurality of electronic componentsFUJITSU LTD·Filed 2004·Granted Apr 24, 2007·30 cites·25 claims
- 1184US7171065B2Compact optical devices and methods for making the sameFUJITSU LTD·Filed 2005·Granted Jan 30, 2007·13 cites·28 claims
- 1282US6193905B1Immersion cooling coolantFUJITSU LTD·Filed 1995·Granted Feb 27, 2001·60 cites·6 claims
- 1379US5349499AImmersion cooling coolant and electronic device using this coolantFUJITSU LTD·Filed 1993·Granted Sep 20, 1994·53 cites·9 claims
- 1479US4642148AMethod for producing a multilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Feb 10, 1987·49 cites·7 claims
- 1577US7453058B2Optical bumps for low-loss interconnection between a device and its supported substrate and related methodsFUJITSU LTD·Filed 2005·Granted Nov 18, 2008·4 cites·13 claims
- 1676US6865310B2Multi-layer thin film optical waveguide switchFUJITSU LTD·Filed 2002·Granted Mar 8, 2005·16 cites·26 claims
- 1774US6996303B2Flexible optical waveguides for backplane optical interconnectionsFUJITSU LTD·Filed 2004·Granted Feb 7, 2006·12 cites·7 claims
- 1873US7277611B1Optical interconnect platform including Bragg diffractive gratings in a bulk materialFUJITSU LTD·Filed 2006·Granted Oct 2, 2007·6 cites·20 claims
- 1973US7072117B2Micro-lens arrayFUJITSU LTD·Filed 2005·Granted Jul 4, 2006·5 cites·9 claims
- 2072US7376295B2Opto-electronic processors with reconfigurable chip-to-chip optical interconnectionsFUJITSU LTD·Filed 2004·Granted May 20, 2008·13 cites·19 claims
- 2172US7257295B2Attachment-type optical coupler apparatusesFUJITSU LTD·Filed 2004·Granted Aug 14, 2007·11 cites·46 claims
- 2271US5783639AComposition of epoxy group-containing cycloolefin resinNIPON ZEON CO LTD·Filed 1997·Granted Jul 21, 1998·27 cites·7 claims
- 2370US7206472B2Optical backplanes with integrated optical couplers and methods of making the sameFUJITSU LTD·Filed 2005·Granted Apr 17, 2007·5 cites·37 claims
- 2469US7999193B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 16, 2011·3 cites·14 claims
- 2569US5593526AProcess for preparing a multi-layer wiring boardFUJITSU LTD·Filed 1994·Granted Jan 14, 1997·36 cites·25 claims
- 2667US8161636B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted Apr 24, 2012·3 cites·5 claims
- 2766US8186053B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted May 29, 2012·4 cites·5 claims
- 2865US5324370AMethod of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constantFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·21 cites·5 claims
- 2964US7283220B2Methods and apparatuses for measuring the refractive index and other optical properties of liquids, gels, and solidsFUJITSU LTD·Filed 2004·Granted Oct 16, 2007·4 cites·26 claims
- 3064US7229219B2Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnectionFUJITSU LTD·Filed 2004·Granted Jun 12, 2007·8 cites·26 claims
- 3164US6734248B2Pattern forming process using polyimide resin compositionNIPPON ZEON CO·Filed 2001·Granted May 11, 2004·4 cites·9 claims
- 3263US4346516AMethod of forming a ceramic circuit substrateFUJITSU LTD·Filed 1981·Granted Aug 31, 1982·24 cites·19 claims
- 3362US5038571AProduction and use of coolant in cryogenic devicesFUJITSU LTD·Filed 1989·Granted Aug 13, 1991·25 cites·38 claims
- 3461US5895800AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Apr 20, 1999·21 cites·8 claims
- 3561US5458709AProcess for manufacturing multi-layer glass ceramic substrateFUJITSU LTD·Filed 1992·Granted Oct 17, 1995·29 cites·8 claims
- 3657US7035524B2Variable optical attenuatorFUJITSU LTD·Filed 2002·Granted Apr 25, 2006·4 cites·16 claims
- 3756US6743851B2Polyimide filmNIPPON ZEON CO·Filed 2001·Granted Jun 1, 2004·3 cites·8 claims
- 3856US6160081APhotosensitive polyimide resin compositionNIPPON ZEON CO·Filed 1998·Granted Dec 12, 2000·18 cites·20 claims
- 3955US4761325AMultilayer ceramic circuit boardFUJITSU LTD·Filed 1985·Granted Aug 2, 1988·18 cites·20 claims
- 4053US7171083B2One-by-N optical switchFUJITSU LTD·Filed 2004·Granted Jan 30, 2007·4 cites·16 claims
- 4152US5886136APattern forming processNIPPON ZEON CO·Filed 1997·Granted Mar 23, 1999·12 cites·28 claims
- 4252US2010051323A1Printed wiring board and conductive wiring layerFUJITSU LTD·Filed 2009·Application pending·0 cites
- 4351US2009151985A1Method of dicing a circuit board sheet and package circuit boardFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4450US2009146112A1Composite material and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4549US7489842B2Attachment-type optical coupler apparatusesFUJITSU LTD·Filed 2007·Granted Feb 10, 2009·0 cites·10 claims
- 4649US7083869B2Methods of forming LaNiO3 conductive layers, ferro-electric devices with LaNiO3 layers, and precursor formation solutionsFUJITSU LTD·Filed 2004·Granted Aug 1, 2006·2 cites·9 claims
- 4748US5777068APhotosensitive polyimide resin compositionNIPPON ZEON CO·Filed 1995·Granted Jul 7, 1998·11 cites·25 claims
- 4847US5275889AMulti-layer wiring boardFUJITSU LTD·Filed 1991·Granted Jan 4, 1994·13 cites·9 claims
- 4945US6310135B1Polyimide resin compositionNIPPON ZEON CO·Filed 1996·Granted Oct 30, 2001·8 cites·8 claims
- 5044US7504014B2High density interconnections with nanowiringFUJITSU LTD·Filed 2005·Granted Mar 17, 2009·0 cites·7 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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