Inventor · disambiguated record
Kazunari Kosakai
Also filed as: KOSAKAI KAZUNARI
2 granted patents·1 pending application·72 citations·filing 1998–2008
65Inventor score
Files withFUJITSU LTD3
Top patents by PatentIndex Score
3 records- 0177US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
- 0266US6281571B1Semiconductor device having an external connection electrode extending through a through hole formed in a substrateFUJITSU LTD·Filed 2000·Granted Aug 28, 2001·13 cites·18 claims
- 0342US2008230950A1Resin sealing method, mold for resin sealing, and resin sealing apparatusFUJITSU LTD·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →