Inventor · disambiguated record
Ranjan J. Mathew
Also filed as: MATHEW RANJAN · MATHEW RANJAN J
33 granted patents·1 pending application·1,374 citations·filing 1985–2007
98Inventor score
Top patents by PatentIndex Score
34 records- 0195US5923995AMethods and apparatuses for singulation of microelectromechanical systemsNAT SEMICONDUCTOR CORP·Filed 1997·Granted Jul 13, 1999·258 cites·13 claims
- 0294US7880310B2Direct device attachment on dual-mode wirebond dieINTEL CORP·Filed 2007·Granted Feb 1, 2011·36 cites·12 claims
- 0392US6927156B2Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric siliconINTEL CORP·Filed 2003·Granted Aug 9, 2005·62 cites·15 claims
- 0490US5328079AMethod of and arrangement for bond wire connecting together certain integrated circuit componentsNAT SEMICONDUCTOR CORP·Filed 1993·Granted Jul 12, 1994·148 cites·9 claims
- 0589US5804880ASolder isolating lead frameNAT SEMICONDUCTOR CORP·Filed 1996·Granted Sep 8, 1998·105 cites·14 claims
- 0685US7262513B2Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric siliconINTEL CORP·Filed 2005·Granted Aug 28, 2007·11 cites·19 claims
- 0783US4922322ABump structure for reflow bonding of IC devicesNAT SEMICONDUCTOR CORP·Filed 1989·Granted May 1, 1990·61 cites·1 claims
- 0878US5596225ALeadframe for an integrated circuit package which electrically interconnects multiple integrated circuit dieNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jan 21, 1997·55 cites·21 claims
- 0977US5436082AProtective coating combination for lead framesNAT SEMICONDUCTOR CORP·Filed 1993·Granted Jul 25, 1995·33 cites·11 claims
- 1075US6556269B1Connection assembly for reflective liquid crystal display and methodNAT SEMICONDUCTOR CORP·Filed 2002·Granted Apr 29, 2003·13 cites·13 claims
- 1175US6476885B1Stress-free socketed optical display package with die non-rigidly attached to containment structureNAT SEMICONDUCTOR CORP·Filed 1999·Granted Nov 5, 2002·56 cites·59 claims
- 1272US6122033AFusible seal for LCD devices and methods for making sameNAT SEMICONDUCTOR CORP·Filed 1998·Granted Sep 19, 2000·43 cites·51 claims
- 1372US5728285AProtective coating combination for lead framesNAT SEMICONDUCTOR CORP·Filed 1997·Granted Mar 17, 1998·41 cites·1 claims
- 1471US6356334B1Liquid crystal display assembly and method for reducing residual stressesNAT SEMICONDUCTOR CORP·Filed 1998·Granted Mar 12, 2002·45 cites·18 claims
- 1568US5783866ALow cost ball grid array device and method of manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jul 21, 1998·32 cites·9 claims
- 1668US5650661AProtective coating combination for lead framesNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 22, 1997·34 cites·26 claims
- 1767US5208186AProcess for reflow bonding of bumps in IC devicesNAT SEMICONDUCTOR CORP·Filed 1991·Granted May 4, 1993·37 cites·6 claims
- 1866US6384890B1Connection assembly for reflective liquid crystal projection with branched PCB displayNAT SEMICONDUCTOR CORP·Filed 1999·Granted May 7, 2002·25 cites·15 claims
- 1965US5270262AO-ring packageNAT SEMICONDUCTOR CORP·Filed 1991·Granted Dec 14, 1993·35 cites·11 claims
- 2064US6357763B2Seal for LCD devices and methods for making sameNAT SEMICONDUCTOR CORP·Filed 1998·Granted Mar 19, 2002·33 cites·12 claims
- 2163US6054338ALow cost ball grid array device and method of manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1998·Granted Apr 25, 2000·26 cites·4 claims
- 2263US5832585AMethod of separating micro-devices formed on a substrateNAT SEMICONDUCTOR CORP·Filed 1996·Granted Nov 10, 1998·29 cites·12 claims
- 2361US4714517ACopper cleaning and passivating for tape automated bondingNAT SEMICONDUCTOR CORP·Filed 1986·Granted Dec 22, 1987·31 cites·8 claims
- 2456US6284566B1Chip scale package and method for manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1999·Granted Sep 4, 2001·20 cites·13 claims
- 2555US4800178AMethod of electroplating a copper lead frame with copperNAT SEMICONDUCTOR CORP·Filed 1987·Granted Jan 24, 1989·25 cites·5 claims
- 2654US5969783AReflective liquid crystal display and connection assembly and methodNAT SEMICONDUCTOR CORP·Filed 1998·Granted Oct 19, 1999·19 cites·9 claims
- 2748US6459143B2Method of packaging fusesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Oct 1, 2002·2 cites·3 claims
- 2847US6140708AChip scale package and method for manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1997·Granted Oct 31, 2000·13 cites·16 claims
- 2946US4589962ASolder plating process and semiconductor productNAT SEMICONDUCTOR CORP·Filed 1985·Granted May 20, 1986·17 cites·9 claims
- 3043US6498636B1Apparatus and method for substantially stress-free electrical connection to a liquid crystal displayNAT SEMICONDUCTOR CORP·Filed 1999·Granted Dec 24, 2002·11 cites·38 claims
- 3142US2007145607A1System to wirebond power signals to flip-chip coreMATHEW RANJAN J·Filed 2005·Application pending·0 cites
- 3239US6255141B1Method of packaging fusesNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jul 3, 2001·6 cites·12 claims
- 3337US7102703B1Liquid crystal display assembly for reducing optical defectsNAT SEMICONDUCTOR CORP·Filed 1999·Granted Sep 5, 2006·10 cites·28 claims
- 3431US4963233AGlass conditioning for ceramic package platingNAT SEMICONDUCTOR CORP·Filed 1989·Granted Oct 16, 1990·2 cites·4 claims
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