Inventor · disambiguated record
Gregory Khosrov Arslanian
Also filed as: ARSLANIAN GREGORY K · ARSLANIAN GREGORY KHOSROV
13 granted patents·1 pending application·128 citations·filing 1993–2023
91Inventor score
Top patents by PatentIndex Score
14 records- 0187US5364007AInert gas delivery for reflow solder furnacesAIR PROD & CHEM·Filed 1993·Granted Nov 15, 1994·59 cites·16 claims
- 0284US7883602B2Electrode assembly for the removal of surface oxides by electron attachmentAIR PROD & CHEM·Filed 2008·Granted Feb 8, 2011·6 cites·13 claims
- 0383US8617352B2Electrode assembly for the removal of surface oxides by electron attachmentDONG CHUN CHRISTINE·Filed 2010·Granted Dec 31, 2013·4 cites·16 claims
- 0482US6345451B1Method and apparatus for hot continuous fiber cooling with cooling gas recirculationAIR PROD & CHEM·Filed 2000·Granted Feb 12, 2002·15 cites·41 claims
- 0578US8361340B2Removal of surface oxides by electron attachmentAIR PROD & CHEM·Filed 2009·Granted Jan 29, 2013·6 cites·21 claims
- 0678US8119016B2Removal of surface oxides by electron attachment for wafer bumping applicationsDONG CHUN CHRISTINE·Filed 2008·Granted Feb 21, 2012·4 cites·12 claims
- 0778US7897029B2Removal of surface oxides by electron attachmentAIR PROD & CHEM·Filed 2008·Granted Mar 1, 2011·6 cites·21 claims
- 0876US9649590B2System and method for gas recovery and reuseAIR PROD & CHEM·Filed 2014·Granted May 16, 2017·3 cites·16 claims
- 0976US8454850B2Method for the removal of surface oxides by electron attachmentDONG CHUN CHRISTINE·Filed 2010·Granted Jun 4, 2013·5 cites·21 claims
- 1076US7387738B2Removal of surface oxides by electron attachment for wafer bumping applicationsAIR PROD & CHEM·Filed 2003·Granted Jun 17, 2008·13 cites·57 claims
- 1171US8579182B2Method for providing an inerting gas during solderingDONG CHUN CHRISTINE·Filed 2012·Granted Nov 12, 2013·2 cites·13 claims
- 1261US7563380B2Electrode assembly for the removal of surface oxides by electron attachmentAIR PROD & CHEM·Filed 2004·Granted Jul 21, 2009·5 cites·25 claims
- 1358US12512431B2Apparatus and method for wafer oxide removal and reflow treatmentAIR PROD & CHEM·Filed 2023·Granted Dec 30, 2025·0 cites·13 claims
- 1447US2014027495A1Apparatus And Method For Providing An Inerting Gas During SolderingAIR PROD & CHEM·Filed 2013·Application pending·0 cites
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