Inventor · disambiguated record
Paul Nordeen
Also filed as: NORDEEN PAUL · NORDEEN PAUL K · NORDEEN PAUL KILLIAN
2 granted patents·10 pending applications·5 citations·filing 2015–2024
48Inventor score
Top patents by PatentIndex Score
12 records- 0176US9660349B2Multiferroic surface acoustic wave antennaKELLER SCOTT MACKLIN·Filed 2015·Granted May 23, 2017·4 cites·20 claims
- 0259US2025309100A1Low resistivity conductor subtractively patterned interconnects using layer transfer of microstructure engineered thin filmsINTEL CORP·Filed 2024·Application pending·0 cites
- 0357US9524709B2Multiferroic transducer for audio applicationsUNIV CALIFORNIA·Filed 2015·Granted Dec 20, 2016·1 cites·18 claims
- 0457US2025273478A1Infrared laser debond process for fusion-bonded or hybrid-bonded die complexes on reusable carrier wafersINTEL CORP·Filed 2024·Application pending·0 cites
- 0556US2025113520A1Transfer of a 2d material to a target substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 0653US2025113521A1Direct transfer of transition metal dichalcogenide monolayers using diffusion bonding layersINTEL CORP·Filed 2023·Application pending·0 cites
- 0747US2024213118A1Gallium nitride (gan) devices with through-silicon viasINTEL CORP·Filed 2022·Application pending·0 cites
- 0846US2023054719A1Gallium nitride (gan) layer transfer and regrowth for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 0945US2023066336A1Gallium nitride (gan) epitaxy on patterned substrate for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 1044US2023090106A1Gallium nitride (gan) layer transfer for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 1144US2023069054A1Gallium nitride (gan) integrated circuit technology with multi-layer epitaxy and layer transferINTEL CORP·Filed 2021·Application pending·0 cites
- 1241US2022093683A13d heterogeneous integrated crystalline piezoelectric bulk acoustic resonatorsINTEL CORP·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →