Inventor · disambiguated record
Steven Webster
Also filed as: WEBSTER STEVEN · WEBSTER STEVEN G · WEBSTER STEVEN GREGORY
136 granted patents·16 pending applications·7,389 citations·filing 1999–2025
99Inventor score
Files withAMKOR TECHNOLOGY INC82APPLE INC36ALTUS TECHNOLOGY INC16HON HAI PREC IND CO LTD7COGNEX CORP3
Top patents by PatentIndex Score
152 records- 0199US9030440B2Capacitive sensor packagingAPPLE INC·Filed 2013·Granted May 12, 2015·69 cites·33 claims
- 0299US6791076B2Image sensor packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Sep 14, 2004·190 cites·20 claims
- 0399US6686588B1Optical module with lens integral holderAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·267 cites·41 claims
- 0499US6577013B1Chip size semiconductor packages with stacked diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·559 cites·28 claims
- 0599US6571466B1Flip chip image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 3, 2003·282 cites·20 claims
- 0698US9135495B1Capacitive sensor packagingAPPLE INC·Filed 2015·Granted Sep 15, 2015·37 cites·20 claims
- 0798US6734419B1Method for forming an image sensor package with vision die in lens housingAMKOR TECHNOLOGY INC·Filed 2001·Granted May 11, 2004·209 cites·14 claims
- 0898US6672773B1Optical fiber having tapered end and optical connector with reciprocal openingAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 6, 2004·158 cites·22 claims
- 0998US6545345B1Mounting for a package containing a chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Apr 8, 2003·199 cites·14 claims
- 1098US6503780B1Wafer scale image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 7, 2003·355 cites·32 claims
- 1198US6483101B1Molded image sensor package having lens holderAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 19, 2002·235 cites·21 claims
- 1298US6424315B1Semiconductor chip having a radio-frequency identification transceiverAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·249 cites·21 claims
- 1398US6407381B1Wafer scale image sensor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·346 cites·18 claims
- 1498US6342406B1Flip chip on glass image sensor package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·174 cites·18 claims
- 1598US6266197B1Molded window array for image sensor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 24, 2001·337 cites·17 claims
- 1697US9576178B2Capacitive sensor packagingAPPLE INC·Filed 2016·Granted Feb 21, 2017·20 cites·21 claims
- 1797US9268989B2Capacitive sensor packagingAPPLE INC·Filed 2015·Granted Feb 23, 2016·20 cites·24 claims
- 1897US9001081B2Capacitive sensor packagingAPPLE INC·Filed 2014·Granted Apr 7, 2015·30 cites·30 claims
- 1997US7199359B2Camera module fabrication method including singulating a substrateAMKOR TECHNOLOGY INC·Filed 2006·Granted Apr 3, 2007·33 cites·20 claims
- 2097US6530515B1Micromachine stacked flip chip package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·151 cites·18 claims
- 2197US6492699B1Image sensor package having sealed cavity over active areaAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·148 cites·16 claims
- 2296US9632327B2Mirror tilt actuationAPPLE INC·Filed 2016·Granted Apr 25, 2017·18 cites·20 claims
- 2396US9285566B2Mirror tilt actuationAPPLE INC·Filed 2013·Granted Mar 15, 2016·29 cites·20 claims
- 2496US6455927B1Micromirror device packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·126 cites·29 claims
- 2595US8988564B2Digital camera with light splitterWEBSTER STEVEN·Filed 2011·Granted Mar 24, 2015·41 cites·21 claims
- 2695US7332712B2Camera module fabrication method including the step of removing a lens mount and window from the moldAMKOR TECHNOLOGY INC·Filed 2007·Granted Feb 19, 2008·21 cites·20 claims
- 2795US6448506B1Semiconductor package and circuit board for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 10, 2002·125 cites·27 claims
- 2895US6441503B1Bond wire pressure sensor die packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 27, 2002·124 cites·28 claims
- 2995US6406934B1Wafer level production of chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·104 cites·20 claims
- 3094US10969652B2Camera with folded optics having moveable lensAPPLE INC·Filed 2019·Granted Apr 6, 2021·10 cites·20 claims
- 3194US7126111B2Camera module having a threaded lens barrel and a ball grid array connecting deviceAMKOR TECHNOLOGY INC·Filed 2005·Granted Oct 24, 2006·18 cites·19 claims
- 3294US6943429B1Wafer having alignment marks extending from a first to a second surface of the waferAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 13, 2005·97 cites·30 claims
- 3394US6486545B1Pre-drilled ball grid array packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 26, 2002·92 cites·34 claims
- 3494US6432737B1Method for forming a flip chip pressure sensor die packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 13, 2002·101 cites·26 claims
- 3593US10373992B1Compact camera moduleAPPLE INC·Filed 2017·Granted Aug 6, 2019·13 cites·20 claims
- 3693US6849916B1Flip chip on glass sensor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 1, 2005·64 cites·28 claims
- 3793US6522015B1Micromachine stacked wirebonded packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·70 cites·21 claims
- 3893US6483030B1Snap lid image sensor packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 19, 2002·105 cites·19 claims
- 3993US6399463B1Method of singulation using laser cuttingAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·74 cites·8 claims
- 4092US11934090B2Camera with folded optics having moveable lensAPPLE INC·Filed 2021·Granted Mar 19, 2024·2 cites·20 claims
- 4192US6528875B1Vacuum sealed package for semiconductor chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 4, 2003·75 cites·14 claims
- 4291US10162191B2Mirror tilt actuationAPPLE INC·Filed 2017·Granted Dec 25, 2018·5 cites·17 claims
- 4391US6564454B1Method of making and stacking a semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted May 20, 2003·76 cites·17 claims
- 4491US6399418B1Method for forming a reduced thickness packaged electronic deviceAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 4, 2002·65 cites·26 claims
- 4591US6309943B1Precision marking and singulation methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·67 cites·29 claims
- 4690US7729606B2Lens module and digital camera module using sameHON HAI PREC IND CO LTD·Filed 2007·Granted Jun 1, 2010·14 cites·13 claims
- 4790US7609461B1Optical module having cavity substrateAMKOR TECHNOLOGY INC·Filed 2005·Granted Oct 27, 2009·16 cites·16 claims
- 4890US7408205B2Digital camera moduleALTUS TECHNOLOGY INC·Filed 2006·Granted Aug 5, 2008·22 cites·14 claims
- 4990US6580167B1Heat spreader with spring IC packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 17, 2003·61 cites·26 claims
- 5090US6429513B1Active heat sink for cooling a semiconductor chipAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·76 cites·48 claims
Showing the top 50 of 152 patent records by PatentIndex Score.
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