Inventor · disambiguated record
Andrew C. Herron
Also filed as: HERRON ANDREW · HERRON ANDREW C
1 granted patent·2 pending applications·2 citations·filing 2014–2018
18Inventor score
Top patents by PatentIndex Score
3 records- 0169US10830656B2Overmolded lead frame assembly for pressure sensing applicationsSENSATA TECHNOLOGIES INC·Filed 2018·Granted Nov 10, 2020·2 cites·20 claims
- 0241US2015286616A1Method For Generating A Document Using An Electronic ClipboardEPHOX CORP·Filed 2014·Application pending·0 cites
- 0329US2019391046A1First level package for pressure sensor moduleSENSATA TECHNOLOGIES INC·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →