Inventor · disambiguated record
Soichi Sakamoto
Also filed as: SAKAMOTO SOICHI
6 granted patents·20 citations·filing 2015–2021
77Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0187US9818716B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 14, 2017·8 cites·6 claims
- 0285US9899345B2Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical powerMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 20, 2018·6 cites·20 claims
- 0373US11004761B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 11, 2021·2 cites·7 claims
- 0472US11538728B2Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrierMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 27, 2022·2 cites·10 claims
- 0570US10559538B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 11, 2020·2 cites·20 claims
- 0658US12183647B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →