Inventor · disambiguated record
Han-Hsiang Huang
Also filed as: HUANG HAN-HSIANG
19 granted patents·7 pending applications·284 citations·filing 1999–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15REALTEK SEMICONDUCTOR CORP4MACROBLOCK INC3ADVANCED SEMICONDUCTOR ENG2TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
26 records- 0197US11756928B2Multi-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 0296US10763239B2Multi-chip wafer level packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·13 cites·17 claims
- 0395US12381180B2Multi-chip packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·1 cites·20 claims
- 0494US8787051B2Method and apparatus for controlling the equivalent resistance of a converterMACROBLOCK INC·Filed 2012·Granted Jul 22, 2014·23 cites·12 claims
- 0591US11189596B2Methods of forming multi-chip wafer level packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 0690US6229702B1Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capabilityADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 8, 2001·123 cites·19 claims
- 0789US6191360B1Thermally enhanced BGA packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 20, 2001·109 cites·6 claims
- 0881US12074101B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 0979US11526189B2Voltage reduction circuit for bandgap reference voltage circuitREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Dec 13, 2022·1 cites·10 claims
- 1079US2024363517A1Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1179US2025349790A1Bridging-resistant microbump structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1278US7557423B2Semiconductor structure with a discontinuous material density for reducing eddy currentsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 7, 2009·8 cites·18 claims
- 1378US2025349559A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1476US2025316622A1Basin-shaped underbump plates and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1573US11342306B2Multi-chip wafer level packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 1671US11823887B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 1769US2024282589A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1867US12424586B2Bridging-resistant microbump structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 1966US12362299B2Basin-shaped underbump plates and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 2064US9263941B2Power factor-corrected resonant converter and parallel power factor-corrected resonant converterMACROBLOCK INC·Filed 2012·Granted Feb 16, 2016·2 cites·37 claims
- 2159US11216021B2Current generation circuitREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Jan 4, 2022·0 cites·15 claims
- 2259US2025216884A1Reference current generating circuit and associated calibration methodREALTEK SEMICONDUCTOR CORP·Filed 2024·Application pending·0 cites
- 2354US11835979B2Voltage regulator deviceREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 2452US2023317577A1Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2551US12476215B2Power delivery structures and methods of manufacturing thereofTAIWAN SEMICONDUTOR MFG COMPANY LTD·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 2640US8937463B2Common-core power factor correction resonant converterMACROBLOCK INC·Filed 2012·Granted Jan 20, 2015·0 cites·9 claims
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