Inventor · disambiguated record

Tsung-Tien Hsieh

Also filed as: HSIEH TSUNG-TIEN

1 granted patent·1 pending application·71 citations·filing 2007–2014

51Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD2

Top patents by PatentIndex Score

2 records

0193US7732913B2Semiconductor package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jun 8, 2010·71 cites·12 claims
0238US2015137337A1Semiconductor package and lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites

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