Inventor · disambiguated record
Jae-Ryoung Lee
Also filed as: LEE JAE-RYOUNG
2 granted patents·2 pending applications·9 citations·filing 2008–2024
47Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0169US8042593B2Semiconductor chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 25, 2011·9 cites·18 claims
- 0258US2025266273A1Chip ejecting apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0348US11239104B2Chip ejecting apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·17 claims
- 0437US2009035105A1Apparatus for separating chip, a method for fabricating the apparatus, and a method for separating a chipSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →