Inventor · disambiguated record
Butch Berney
Also filed as: BERNEY BUTCH
11 granted patents·8 pending applications·1,486 citations·filing 1996–2025
93Inventor score
Top patents by PatentIndex Score
19 records- 0199US7611640B1Minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2006·Granted Nov 3, 2009·365 cites·33 claims
- 0299US7086347B2Apparatus and methods for minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2002·Granted Aug 8, 2006·380 cites·31 claims
- 0394US6184158B1Inductively coupled plasma CVDLAM RES CORP·Filed 1996·Granted Feb 6, 2001·193 cites·60 claims
- 0494US5835334AVariable high temperature chuck for high density plasma chemical vapor depositionLAM RESEARCH·Filed 1996·Granted Nov 10, 1998·269 cites·51 claims
- 0591US6203657B1Inductively coupled plasma downstream strip moduleLAM RES CORP·Filed 1998·Granted Mar 20, 2001·139 cites·11 claims
- 0689US6692649B2Inductively coupled plasma downstream strip moduleLAM RES CORP·Filed 2001·Granted Feb 17, 2004·42 cites·15 claims
- 0789US6270862B1Method for high density plasma chemical vapor deposition of dielectric filmsLAM RES CORP·Filed 1999·Granted Aug 7, 2001·88 cites·25 claims
- 0888US10861719B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2020·Granted Dec 8, 2020·2 cites·11 claims
- 0988US10720343B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jul 21, 2020·5 cites·21 claims
- 1079US10312117B2Apparatus and radiant heating plate for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jun 4, 2019·3 cites·20 claims
- 1169US2025291253A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2025·Application pending·0 cites
- 1256US2022308462A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2020·Application pending·0 cites
- 1355US2025218819A1Radiative heat windows and wafer support pads in vapor etch reactorsLAM RES CORP·Filed 2023·Application pending·0 cites
- 1455US2025216268A1Dual sensor wafer temperature measurement systemLAM RES CORP·Filed 2023·Application pending·0 cites
- 1553US2025273441A1Liquid-cooled optical window for semiconductor processing chamberLAM RES CORP·Filed 2023·Application pending·0 cites
- 1648US12198945B2Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structuresLAM RES AG·Filed 2019·Granted Jan 14, 2025·0 cites·18 claims
- 1746US2023131233A1Rapid and precise temperature control for thermal etchingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1840US2004149223A1Inductively coupled plasma downstream strip moduleLAM RES CORP·Filed 2003·Application pending·0 cites
- 1938US2001019903A1Inductively coupled plasma CVDFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →