Inventor · disambiguated record
Chen Peng
Also filed as: PENG CHEN P · PENG CHEN PIN
17 granted patents·13 pending applications·272 citations·filing 2001–2021
92Inventor score
Top patents by PatentIndex Score
30 records- 0194US6400007B1Stacked structure of semiconductor means and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Jun 4, 2002·127 cites·11 claims
- 0291US7554599B2Image sensor module with air escape hole and a method for manufacturing the sameKINGPAK TECH INC·Filed 2006·Granted Jun 30, 2009·17 cites·9 claims
- 0390US11133348B2Sensor package structure and sensing module thereofKINGPAK TECH INC·Filed 2020·Granted Sep 28, 2021·3 cites·10 claims
- 0489US7423334B2Image sensor module with a protection layer and a method for manufacturing the sameKINGPAK TECH INC·Filed 2005·Granted Sep 9, 2008·20 cites·2 claims
- 0589US6472736B1Stacked structure for memory chipsKINGPAK TECH INC·Filed 2002·Granted Oct 29, 2002·66 cites·5 claims
- 0684US7598580B1Image sensor module package structure with supporting elementKINGPAK TECH INC·Filed 2008·Granted Oct 6, 2009·14 cites·15 claims
- 0781US10868062B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Dec 15, 2020·4 cites·7 claims
- 0872US10411055B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Sep 10, 2019·2 cites·11 claims
- 0969US6642137B2Method for manufacturing a package structure of integrated circuitsKINGPAK TECH INC·Filed 2002·Granted Nov 4, 2003·14 cites·5 claims
- 1059US9184331B2Method for reducing tilt of optical unit during manufacture of image sensorKINGPAK TECH INC·Filed 2013·Granted Nov 10, 2015·1 cites·20 claims
- 1157US8004602B2Image sensor structure and integrated lens module thereofKINGPAK TECH INC·Filed 2008·Granted Aug 23, 2011·1 cites·15 claims
- 1250US11735562B2Sensor package structureKINGPAK TECH INC·Filed 2021·Granted Aug 22, 2023·0 cites·10 claims
- 1345US2007138585A1Image sensor packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 1444US2009045476A1Image sensor package and method for forming the sameKINGPAK TECH INC·Filed 2007·Application pending·0 cites
- 1543US2008067334A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2007·Application pending·0 cites
- 1642US2008036025A1Image sensor packageHSIN CHUNG H·Filed 2007·Application pending·0 cites
- 1740US2007096280A1Image sensor module structure and a method for manufacturing the sameTU HSIU W·Filed 2005·Application pending·0 cites
- 1840US2007108544A1Image sensor with a compound structureTU HSIU W·Filed 2005·Application pending·0 cites
- 1939US2007138586A1Image sensor module packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 2037US6501187B1Semiconductor package structure having central leads and method for packaging the sameFiled 2001·Granted Dec 31, 2002·1 cites·8 claims
- 2136US2007090284A1Image sensor package structureHO MON N·Filed 2005·Application pending·0 cites
- 2234US10600829B2Package base core and sensor package structureKINGPAK TECH INC·Filed 2017·Granted Mar 24, 2020·0 cites·8 claims
- 2334US8450137B2Method for reducing tilt of transparent window during manufacturing of image sensorCHUANG CHUN-HUA·Filed 2012·Granted May 28, 2013·0 cites·12 claims
- 2434US2003116846A1Stacked structure of a ball grid array (BGA) integrated circuit packageFiled 2001·Application pending·0 cites
- 2532US7235869B2Integrated circuit package having a resistant layer for stopping flowed glueKINGPAK TECH INC·Filed 2003·Granted Jun 26, 2007·0 cites·3 claims
- 2632US6642554B2Memory module structureKINGPAK TECH INC·Filed 2001·Granted Nov 4, 2003·2 cites·8 claims
- 2732US2003116817A1Image sensor structureFiled 2001·Application pending·0 cites
- 2830US2002096766A1Package structure of integrated circuits and method for packaging the sameFiled 2001·Application pending·0 cites
- 2928US2002096754A1Stacked structure of integrated circuitsFiled 2001·Application pending·0 cites
- 3027US2002151102A1Stacked semiconductor package structure having films and method for manufacturing the filmsFiled 2001·Application pending·0 cites
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