Inventor · disambiguated record
Takahumi Mizuguchi
Also filed as: MIZUGUCHI Takahumi
1 granted patent·3 pending applications·0 citations·filing 2021–2021
6Inventor score
Files withNIPPON KAYAKU KK4
Top patents by PatentIndex Score
4 records- 0155US2023374186A1Photosensitive resin composition, cured product thereof and multilayer materialNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
- 0250US2024174809A1Resin composition, resin sheet, multilayered printed wiring board, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
- 0340US12486371B2Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Granted Dec 2, 2025·0 cites·15 claims
- 0436US2024191030A1Resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor deviceNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →