Inventor · disambiguated record
Shinichi Watanuki
Also filed as: WATANUKI SHINICHI
29 granted patents·3 pending applications·52 citations·filing 1998–2024
94Inventor score
Top patents by PatentIndex Score
32 records- 0192US11079540B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Aug 3, 2021·7 cites·14 claims
- 0291US9508662B2Optical semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·9 cites·9 claims
- 0387US10921515B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 16, 2021·4 cites·16 claims
- 0485US9835882B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·4 cites·8 claims
- 0584US9696489B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 4, 2017·4 cites·6 claims
- 0682US10295743B2Optical semiconductor device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 21, 2019·4 cites·13 claims
- 0781US10895681B2Semiconductor module, manufacturing method thereof, and communication method using the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jan 19, 2021·3 cites·19 claims
- 0869US10416382B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 17, 2019·1 cites·14 claims
- 0968US9977186B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted May 22, 2018·1 cites·10 claims
- 1067US10162110B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 25, 2018·1 cites·20 claims
- 1166US10466415B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 5, 2019·0 cites·8 claims
- 1265US11808974B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Granted Nov 7, 2023·0 cites·13 claims
- 1361US10416481B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 17, 2019·0 cites·20 claims
- 1458US2024313145A1Light receiving elementAIO CORE CO LTD·Filed 2024·Application pending·0 cites
- 1557US9927573B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Mar 27, 2018·0 cites·14 claims
- 1655US10038114B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 31, 2018·0 cites·4 claims
- 1755US10025048B2Semiconductor device having quadrangular interposer with functional blocks having arranged regions and waveguidesRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 17, 2018·0 cites·5 claims
- 1855US9739964B2Semiconductor device having quadrangular interposer with plural functional blocks having arranged regionsRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 22, 2017·0 cites·10 claims
- 1954US11764318B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 19, 2023·0 cites·14 claims
- 2053US10527872B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 7, 2020·0 cites·13 claims
- 2153US10317769B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jun 11, 2019·0 cites·10 claims
- 2253US6127267AFabrication method of semiconductor device equipped with silicide layerNEC CORP·Filed 1998·Granted Oct 3, 2000·14 cites·20 claims
- 2349US10211352B2Germanium photodiodeRENESAS ELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·0 cites·18 claims
- 2447US10578805B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted Mar 3, 2020·0 cites·19 claims
- 2545US7370304B2System and method for designing and manufacturing LSINEC ELECTRONICS CORP·Filed 2005·Granted May 6, 2008·0 cites·15 claims
- 2644US10078182B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 18, 2018·0 cites·14 claims
- 2742US10355161B2Germanium-based photoreceiver having tungsten contactsRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 16, 2019·0 cites·18 claims
- 2841US10197822B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 5, 2019·0 cites·14 claims
- 2940US10818813B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 27, 2020·0 cites·9 claims
- 3040US2007105053A1Method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 3139US10553734B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 3238US2018136390A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
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