Inventor · disambiguated record
Chin-Kwan Kim
Also filed as: KIM CHIN K · KIM CHIN-KWAN
40 granted patents·20 pending applications·233 citations·filing 1978–2025
97Inventor score
Top patents by PatentIndex Score
60 records- 0197US9379090B1System, apparatus, and method for split die interconnectionQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·43 cites·27 claims
- 0296US10410971B2Thermal and electromagnetic interference shielding for die embedded in package substrateQUALCOMM INC·Filed 2017·Granted Sep 10, 2019·37 cites·30 claims
- 0395US10510733B2Integrated device comprising embedded package on package (PoP) deviceQUALCOMM INC·Filed 2018·Granted Dec 17, 2019·11 cites·24 claims
- 0493US10734332B2High aspect ratio interconnects in air gap of antenna packageQUALCOMM INC·Filed 2017·Granted Aug 4, 2020·9 cites·31 claims
- 0593US9642259B2Embedded bridge structure in a substrateQUALCOMM INC·Filed 2013·Granted May 2, 2017·18 cites·30 claims
- 0692US11239573B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·3 cites·17 claims
- 0792US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 0892US8772951B1Ultra fine pitch and spacing interconnects for substrateQUALCOMM INC·Filed 2013·Granted Jul 8, 2014·16 cites·24 claims
- 0991US9806063B2Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliabilityQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·9 cites·23 claims
- 1090US9679841B2Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Granted Jun 13, 2017·11 cites·21 claims
- 1188US9947642B2Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 17, 2018·10 cites·24 claims
- 1287US9484327B2Package-on-package structure with reduced heightQUALCOMM INC·Filed 2013·Granted Nov 1, 2016·10 cites·10 claims
- 1385US11756894B2Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Sep 12, 2023·2 cites·19 claims
- 1483US9159670B2Ultra fine pitch and spacing interconnects for substrateQUALCOMM INC·Filed 2014·Granted Oct 13, 2015·5 cites·38 claims
- 1582US10431511B2Power amplifier with RF structureQUALCOMM INC·Filed 2017·Granted Oct 1, 2019·4 cites·31 claims
- 1682US10403707B2Array type inductorQUALCOMM INC·Filed 2017·Granted Sep 3, 2019·2 cites·24 claims
- 1778US9355963B2Semiconductor package interconnections and method of making the sameQUALCOMM INC·Filed 2014·Granted May 31, 2016·4 cites·30 claims
- 1877US9269681B2Surface finish on trace for a thermal compression flip chip (TCFC)QUALCOMM INC·Filed 2013·Granted Feb 23, 2016·4 cites·7 claims
- 1974US8253034B2Printed circuit board and semiconductor package with the sameKIM BYOUNG CHAN·Filed 2010·Granted Aug 28, 2012·5 cites·14 claims
- 2071US9601435B2Semiconductor package with embedded components and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·2 cites·14 claims
- 2170US8802556B2Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2013·Granted Aug 12, 2014·2 cites·20 claims
- 2270US2025259948A1Package comprising discrete antenna deviceQUALCOMM INC·Filed 2025·Application pending·0 cites
- 2369US11764489B2Sub-module L-shaped millimeter wave antenna-in-packageQUALCOMM INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 2469US9155191B2Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpageQUALCOMM INC·Filed 2013·Granted Oct 6, 2015·2 cites·19 claims
- 2563US9609751B2Package substrate comprising surface interconnect and cavity comprising electroless fillQUALCOMM INC·Filed 2014·Granted Mar 28, 2017·1 cites·16 claims
- 2663US2025192128A1Artificial Intelligence Engine and Memory InteroperationGOOGLE LLC·Filed 2024·Application pending·0 cites
- 2762US8080741B2Printed circuit boardKANG MYUNG SAM·Filed 2008·Granted Dec 20, 2011·2 cites·10 claims
- 2859US12293980B2Package comprising discrete antenna deviceQUALCOMM INC·Filed 2020·Granted May 6, 2025·0 cites·17 claims
- 2958US12160952B2Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methodsQUALCOMM INC·Filed 2022·Granted Dec 3, 2024·0 cites·28 claims
- 3057US11776888B2Package with a substrate comprising protruding pad interconnectsQUALCOMM INC·Filed 2021·Granted Oct 3, 2023·0 cites·34 claims
- 3156US9370097B2Package substrate with testing pads on fine pitch tracesQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·0 cites·31 claims
- 3253US11637057B2Uniform via pad structure having covered traces between partially covered padsQUALCOMM INC·Filed 2019·Granted Apr 25, 2023·0 cites·8 claims
- 3352US12300873B2Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methodsQUALCOMM INC·Filed 2022·Granted May 13, 2025·0 cites·33 claims
- 3452US9269610B2Pattern between pattern for low profile substrateQUALCOMM INC·Filed 2014·Granted Feb 23, 2016·0 cites·30 claims
- 3552US2023352390A1Package comprising a substrate with a bump pad interconnect comprising a trapezoid shaped cross sectionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3652US2014322868A1Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3751US12354935B2Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 3850US11043740B2Enhanced antenna module with shield layerQUALCOMM INC·Filed 2019·Granted Jun 22, 2021·0 cites·19 claims
- 3949US11258165B2Asymmetric antenna structureQUALCOMM INC·Filed 2018·Granted Feb 22, 2022·0 cites·8 claims
- 4049US10163871B2Integrated device comprising embedded package on package (PoP) deviceQUALCOMM INC·Filed 2016·Granted Dec 25, 2018·0 cites·33 claims
- 4149US2023073823A1Package comprising a substrate with high-density interconnectsQUALCOMM INC·Filed 2021·Application pending·0 cites
- 4248US11075260B2Substrate comprising recessed interconnects and a surface mounted passive componentQUALCOMM INC·Filed 2018·Granted Jul 27, 2021·0 cites·24 claims
- 4346US2009027864A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4446US2016091532A1Flexible film electrical-test substrates with conductive coupling post(s) for integrated circuit (ic) bump(s) electrical testing, and related methods and testing apparatusesQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4544US2016093567A1System, apparatus, and method of interconnection in a substrateQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4644US2015206812A1Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4744US2015187731A1Low cost connector for high speed, high density signal deliveryQUALCOMM INC·Filed 2013·Application pending·0 cites
- 4844US2009133902A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4943US2020091062A1Integrated circuit cavity formation with multiple interconnection padsQUALCOMM INC·Filed 2018·Application pending·0 cites
- 5042US2014175658A1Anchoring a trace on a substrate to reduce peeling of the traceQUALCOMM INC·Filed 2013·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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