Inventor · disambiguated record
Chloe Baldasseroni
Also filed as: BALDASSERONI CHLOE
29 granted patents·6 pending applications·494 citations·filing 2014–2024
96Inventor score
Files withLAM RES CORP35
Top patents by PatentIndex Score
35 records- 0198US9508547B1Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactorsLAM RES CORP·Filed 2015·Granted Nov 29, 2016·31 cites·20 claims
- 0297US9428833B1Method and apparatus for backside deposition reduction by control of wafer support to achieve edge sealLAM RES CORP·Filed 2015·Granted Aug 30, 2016·353 cites·15 claims
- 0396US10665429B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2017·Granted May 26, 2020·6 cites·20 claims
- 0496US9793096B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2015·Granted Oct 17, 2017·16 cites·18 claims
- 0596US9698042B1Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edgeLAM RES CORP·Filed 2016·Granted Jul 4, 2017·23 cites·19 claims
- 0695US10378107B2Low volume showerhead with faceplate holes for improved flow uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·11 cites·26 claims
- 0795US10134579B2Method for high modulus ALD SiO2 spacerLAM RES CORP·Filed 2016·Granted Nov 20, 2018·13 cites·16 claims
- 0894US11072860B2Fill on demand ampoule refillLAM RES CORP·Filed 2015·Granted Jul 27, 2021·6 cites·14 claims
- 0991US10407773B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2017·Granted Sep 10, 2019·6 cites·17 claims
- 1091US9617638B2Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD systemLAM RES CORP·Filed 2014·Granted Apr 11, 2017·9 cites·24 claims
- 1189US11959175B2Fill on demand ampoule refillLAM RES CORP·Filed 2021·Granted Apr 16, 2024·1 cites·19 claims
- 1287US11286560B2Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matchingLAM RES CORP·Filed 2020·Granted Mar 29, 2022·2 cites·20 claims
- 1387US9631276B2Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer depositionLAM RES CORP·Filed 2015·Granted Apr 25, 2017·2 cites·13 claims
- 1486US12040181B2Modulated atomic layer depositionLAM RES CORP·Filed 2019·Granted Jul 16, 2024·4 cites·20 claims
- 1585US2024218515A1Fill on demand ampoule refillLAM RES CORP·Filed 2024·Application pending·0 cites
- 1684US2025019825A1Pedestals for modulating film properties in atomic layer deposition (ald) substrate processing chambersLAM RES CORP·Filed 2024·Application pending·0 cites
- 1781US10697059B2Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matchingLAM RES CORP·Filed 2017·Granted Jun 30, 2020·3 cites·15 claims
- 1881US10100407B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2014·Granted Oct 16, 2018·1 cites·29 claims
- 1981US9624578B2Method for RF compensation in plasma assisted atomic layer depositionLAM RES CORP·Filed 2014·Granted Apr 18, 2017·2 cites·13 claims
- 2079US10622243B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2017·Granted Apr 14, 2020·2 cites·19 claims
- 2179US9920844B2Valve manifold deadleg elimination via reentrant flow pathLAM RES CORP·Filed 2015·Granted Mar 20, 2018·3 cites·34 claims
- 2276US2025062150A1Electrostatic chuck with seal surfaceLAM RES CORP·Filed 2024·Application pending·0 cites
- 2374US12451346B2Modulated atomic layer depositionLAM RES CORP·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 2472US10526700B2Hardware and process for film uniformity improvementLAM RES CORP·Filed 2018·Granted Jan 7, 2020·0 cites·28 claims
- 2569US11127567B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2020·Granted Sep 21, 2021·0 cites·24 claims
- 2668US12110586B2Pedestals for modulating film properties in atomic layer deposition (ALD) substrate processing chambersLAM RES CORP·Filed 2020·Granted Oct 8, 2024·0 cites·13 claims
- 2763US11443975B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2020·Granted Sep 13, 2022·0 cites·24 claims
- 2858US10648079B2Reducing backside deposition at wafer edgeLAM RES CORP·Filed 2014·Granted May 12, 2020·0 cites·18 claims
- 2956US12142509B2Electrostatic chuck with seal surfaceLAM RES CORP·Filed 2019·Granted Nov 12, 2024·0 cites·33 claims
- 3055US10323323B2Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer depositionLAM RES CORP·Filed 2017·Granted Jun 18, 2019·0 cites·13 claims
- 3150US2016052651A1Fill on demand ampouleLAM RES CORP·Filed 2014·Application pending·0 cites
- 3244US9970108B2Systems and methods for vapor delivery in a substrate processing systemLAM RES CORP·Filed 2015·Granted May 15, 2018·0 cites·19 claims
- 3344US2016056032A1Methods and apparatuses for stable deposition rate control in low temperature ald systems by showerhead active heating and/or pedestal coolingLAM RES CORP·Filed 2014·Application pending·0 cites
- 3438US2018334746A1Wafer Edge Contact Hardware and Methods to Eliminate Deposition at Wafer Backside Edge and NotchLAM RES CORP·Filed 2017·Application pending·0 cites
- 3535US10541117B2Systems and methods for tilting a wafer for achieving deposition uniformityLAM RES CORP·Filed 2015·Granted Jan 21, 2020·0 cites·18 claims
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