Inventor · disambiguated record
Mitsuyoshi Matsuda
Also filed as: MATSUDA MITSUYOSHI
12 granted patents·1 pending application·92 citations·filing 1988–2021
87Inventor score
Files withMITSUI MINING & SMELTING CO4MATSUDA MITSUYOSHI2MITSUI MINING & SMELTING CO LTD2ABE KOJI1DOBASHI MAKOTO1
Top patents by PatentIndex Score
13 records- 0183US8715836B2Surface-treated electro-deposited copper foil and method for manufacturing the sameDOBASHI MAKOTO·Filed 2007·Granted May 6, 2014·7 cites·22 claims
- 0277US6969557B2Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the sameMITSUI MINING & SMELTING CO·Filed 2003·Granted Nov 29, 2005·17 cites·17 claims
- 0375US4821331ACoaxial speaker unitPIONEER ELECTRONIC CORP·Filed 1988·Granted Apr 11, 1989·58 cites·5 claims
- 0474US8722199B2Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foilMATSUDA MITSUYOSHI·Filed 2006·Granted May 13, 2014·7 cites·15 claims
- 0568US8419920B2Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper filmTOMONAGA SAKIKO·Filed 2007·Granted Apr 16, 2013·1 cites·11 claims
- 0665US12344953B2Electrolytic copper foilMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Jul 1, 2025·0 cites·4 claims
- 0763US12168838B2Electrolytic copper foilMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·5 claims
- 0857US9077827B2Page-turning reader device and feeder deviceMATSUDA MITSUYOSHI·Filed 2012·Granted Jul 7, 2015·1 cites·18 claims
- 0956US9663868B2Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foilMITSUI MINING & SMELTING CO·Filed 2012·Granted May 30, 2017·0 cites·11 claims
- 1055US9307639B2Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foilSAKAI HISAO·Filed 2007·Granted Apr 5, 2016·1 cites·29 claims
- 1151US2009166213A1Production method of electro-deposited copper foil, electro-deposited copper foil obtained by the production method, surface-treated copper foil obtained by using the electro-deposited copper foil and copper-clad laminate obtained by using the electro-deposited copper foil or the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1245US9338898B2Method of producing a printed wiring boardMITSUI MINING & SMELTING CO·Filed 2013·Granted May 10, 2016·0 cites·8 claims
- 1345US8457506B2Image-forming deviceABE KOJI·Filed 2011·Granted Jun 4, 2013·0 cites·10 claims
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