Inventor · disambiguated record
Tao-Chih Chang
Also filed as: CHANG TAO C · CHANG TAO-CHIH
33 granted patents·13 pending applications·72 citations·filing 1994–2022
95Inventor score
Top patents by PatentIndex Score
46 records- 0194US9647029B2Light-emitting device and manufacturing method of a displayIND TECH RES INST·Filed 2015·Granted May 9, 2017·14 cites·13 claims
- 0290US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0386US8866309B2Chip package structureIND TECH RES INST·Filed 2012·Granted Oct 21, 2014·9 cites·21 claims
- 0483US8130509B2Package carrierTSAI TSUNG-FU·Filed 2009·Granted Mar 6, 2012·11 cites·23 claims
- 0582US11756858B2Power module with housing having bending sectionsIND TECH RES INST·Filed 2021·Granted Sep 12, 2023·1 cites·22 claims
- 0682US9721931B2Semiconductor light emitting device and fabricating method thereofIND TECH RES INST·Filed 2015·Granted Aug 1, 2017·3 cites·15 claims
- 0781US11854961B2Package substrate and method of fabricating the same and chip package structureIND TECH RES INST·Filed 2020·Granted Dec 26, 2023·1 cites·27 claims
- 0881US11004816B2Hetero-integrated structureIND TECH RES INST·Filed 2019·Granted May 11, 2021·3 cites·19 claims
- 0979US8742600B2Dual-phase intermetallic interconnection structure and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Jun 3, 2014·5 cites·17 claims
- 1076US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 1176US9142473B2Stacked type power device moduleIND TECH RES INST·Filed 2013·Granted Sep 22, 2015·5 cites·11 claims
- 1274US10743411B1Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the componentICP TECH CO LTD·Filed 2020·Granted Aug 11, 2020·1 cites·8 claims
- 1374US10490478B2Chip packaging and composite system boardIND TECH RES INST·Filed 2017·Granted Nov 26, 2019·2 cites·29 claims
- 1472US11776867B2Chip packageIND TECH RES INST·Filed 2022·Granted Oct 3, 2023·0 cites·8 claims
- 1570US10490473B2Chip package module and circuit board structure comprising the sameIND TECH RES INST·Filed 2018·Granted Nov 26, 2019·1 cites·19 claims
- 1664US11387159B2Chip packageIND TECH RES INST·Filed 2020·Granted Jul 12, 2022·0 cites·8 claims
- 1759US8093718B2Chip structure and stacked structure of chipsCHANG TAO-CHIH·Filed 2008·Granted Jan 10, 2012·2 cites·15 claims
- 1857US10622274B2Chip packageIND TECH RES INST·Filed 2018·Granted Apr 14, 2020·0 cites·19 claims
- 1955US11239211B2Electronic device having a curved portion between a plurality of conductive portions on a substrateIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·22 claims
- 2054US10037980B2Fabricating method of a semiconductor light emitting deviceIND TECH RES INST·Filed 2017·Granted Jul 31, 2018·0 cites·34 claims
- 2152US11538842B2Chip scale package structuresIND TECH RES INST·Filed 2020·Granted Dec 27, 2022·0 cites·17 claims
- 2251US2009210055A1Artificial optic nerve network module, artificial retina chip module, and method for fabricating the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2349US11239168B2Chip package structureIND TECH RES INST·Filed 2020·Granted Feb 1, 2022·0 cites·19 claims
- 2449US9308603B2Solder, solder joint structure and method of forming solder joint structureIND TECH RES INST·Filed 2013·Granted Apr 12, 2016·0 cites·7 claims
- 2549US2018145236A1Package structure for light emitting deviceIND TECH RES INST·Filed 2017·Application pending·0 cites
- 2648US9143243B2Power module for high/low voltage insulationIND TECH RES INST·Filed 2013·Granted Sep 22, 2015·0 cites·20 claims
- 2747US10784297B2Chip scale package structuresIND TECH RES INST·Filed 2018·Granted Sep 22, 2020·0 cites·12 claims
- 2845US2009152741A1Chip structure and fabrication process thereof and flip chip package structure and fabrication process thereofIND TECH RES INST·Filed 2008·Application pending·0 cites
- 2945US2016163940A1Package structure for light emitting deviceIND TECH RES INST·Filed 2015·Application pending·0 cites
- 3045US2012125669A1Package carrierTSAI TSUNG-FU·Filed 2012·Application pending·0 cites
- 3145US2010207266A1Chip package structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3244US11355472B2Package structure and method for connecting componentsIND TECH RES INST·Filed 2019·Granted Jun 7, 2022·0 cites·3 claims
- 3344US11114387B2Electronic packaging structureIND TECH RES INST·Filed 2018·Granted Sep 7, 2021·0 cites·5 claims
- 3444US2020083332A1Semiconductor device and method for fabricating the sameIND TECH RES INST·Filed 2019·Application pending·0 cites
- 3544US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 3644US2007036952A1Method And Device For Enhancing SolderabilityIND TECH RES INST·Filed 2006·Application pending·0 cites
- 3743US2009050470A1Method And Device For Enhancing SolderabilityIND TECH RES INST·Filed 2008·Application pending·0 cites
- 3842US9024441B2Bump structure and electronic packaging solder joint structure and fabricating method thereofLIN YU-MIN·Filed 2012·Granted May 5, 2015·0 cites·6 claims
- 3939US2012048355A1Semiconductor device module package structure and series connection method thereofHSIEH HSIN-HSIN·Filed 2010·Application pending·0 cites
- 4037US8575754B2Micro-bump structureTSAI TSUNG-FU·Filed 2010·Granted Nov 5, 2013·0 cites·6 claims
- 4137US5432257AProcess for manufacturing a polysulfide polymer from the heavy ends waste of chlorinated hydrocarbon productionFORMOSA PLASTICS CORP·Filed 1994·Granted Jul 11, 1995·3 cites·18 claims
- 4237US2013043599A1Chip package process and chip package structureIND TECH RES INST·Filed 2012·Application pending·0 cites
- 4336US8598686B2Electronic device package structure with a hydrophilic protection layer and method for fabricating the sameCHANG TAO-CHIH·Filed 2010·Granted Dec 3, 2013·0 cites·25 claims
- 4436US2018233477A1Electronic packaging structureIND TECH RES INST·Filed 2017·Application pending·0 cites
- 4532US8502378B2Package unit and stacking structure thereofHUNG YIN-PO·Filed 2011·Granted Aug 6, 2013·0 cites·10 claims
- 4627US5466763AHigh performance epoxy resin modified by a polysulfide polymer derived from the heavy ends waste of chlorinated hydrocarbon productionFORMOSA PLASTICS CORP·Filed 1994·Granted Nov 14, 1995·0 cites·20 claims
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