Inventor · disambiguated record
Kyu-Hyok Yim
Also filed as: YIM KYU H · YIM KYU-HYOK
11 granted patents·1 pending application·138 citations·filing 2003–2017
90Inventor score
Top patents by PatentIndex Score
12 records- 0186US6996305B2Printed circuit board with opto-via holes and process of forming the opto-via holesSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 7, 2006·32 cites·15 claims
- 0285US7281328B2Method of fabricating rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·20 cites·5 claims
- 0385US7033457B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 25, 2006·13 cites·10 claims
- 0485US6839476B2Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jan 4, 2005·32 cites·74 claims
- 0571US6905569B2Method of embedding optical fiber in multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 14, 2005·13 cites·22 claims
- 0667US7025849B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 11, 2006·9 cites·10 claims
- 0764US10642597B2Integrated management and update method of DC-DC converter and battery management system (BMS) software installed in residential ESSLG CHEMICAL LTD·Filed 2017·Granted May 5, 2020·1 cites·20 claims
- 0861US7197202B2Optical printed circuit board for long-distance signal transmissionSAMSUNG ELECTRO MECH·Filed 2003·Granted Mar 27, 2007·7 cites·13 claims
- 0958US6978058B2Multi-layer PCB and method for coupling block type multichannel optical signalsSAMSUNG ELECTRO MECH·Filed 2003·Granted Dec 20, 2005·7 cites·44 claims
- 1055US7046870B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2003·Granted May 16, 2006·4 cites·4 claims
- 1147US7350295B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 1, 2008·0 cites·28 claims
- 1240US2007104929A1Method for plating printed circuit board and printed circuit board manufactured therefromYMT CO LTD·Filed 2006·Application pending·0 cites
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