Inventor · disambiguated record
Keisuke Kawamura
Also filed as: KAWAMURA KEISUKE
26 granted patents·11 pending applications·855 citations·filing 1997–2022
96Inventor score
Files withAIR WATER INC12MITSUBISHI HEAVY IND LTD10NIPPON STEEL CORP4HONDA MOTOR CO LTD3KAWAMURA KEISUKE2
Top patents by PatentIndex Score
37 records- 0198US7204887B2Wafer holding, wafer support member, wafer boat and heat treatment furnaceNIPPON STEEL CORP·Filed 2001·Granted Apr 17, 2007·581 cites·11 claims
- 0289US10186421B2Composite semiconductor substrateAIR WATER INC·Filed 2016·Granted Jan 22, 2019·10 cites·12 claims
- 0387US7205034B2Method and device for generating uniform high-frequency plasma over large surface area used for plasma chemical vapor deposition apparatusMITSUBISHI HEAVY IND LTD·Filed 2002·Granted Apr 17, 2007·38 cites·19 claims
- 0485US6007681AApparatus and method for treating exhaust gas and pulse generator used thereforMITSUBISHI HEAVY IND LTD·Filed 1997·Granted Dec 28, 1999·57 cites·3 claims
- 0584US7141516B2High frequency plasma generator and high frequency plasma generating methodMITSUBISHI HEAVY IND LTD·Filed 2003·Granted Nov 28, 2006·20 cites·5 claims
- 0681US7167358B2Information terminal apparatusSONY CORP·Filed 2004·Granted Jan 23, 2007·34 cites·5 claims
- 0780US7833587B2Method for plasma-enhanced chemical vapor deposition and apparatus for plasma-enhanced chemical vapor depositionMITSUBISHI HEAVY IND LTD·Filed 2003·Granted Nov 16, 2010·16 cites·10 claims
- 0879US7319295B2High-frequency power supply structure and plasma CVD device using the sameMITSUBISHI HEAVY IND LTD·Filed 2003·Granted Jan 15, 2008·15 cites·6 claims
- 0977US10253843B2Vibration reduction apparatus of hybrid vehicleHONDA MOTOR CO LTD·Filed 2017·Granted Apr 9, 2019·2 cites·8 claims
- 1076US11316018B2Compound semiconductor substrate including electron transition layer and barrier layerAIR WATER INC·Filed 2018·Granted Apr 26, 2022·2 cites·7 claims
- 1172US7067402B2Production method for SIMOX substrate and SIMOX substrateNIPPON STEEL CORP·Filed 2002·Granted Jun 27, 2006·21 cites·16 claims
- 1266US10086841B2Control apparatus for transmissionHONDA MOTOR CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·12 claims
- 1366US6558637B2Exhaust emission purifierMITSUBISHI MOTORS CORP·Filed 2001·Granted May 6, 2003·15 cites·17 claims
- 1456US6558636B2Plasma type exhaust gas cleaning apparatusMITSUBISHI MOTORS CORP·Filed 2001·Granted May 6, 2003·5 cites·11 claims
- 1554US6767801B2Simox substrate and method for production thereofNIPPON STEEL CORP·Filed 2001·Granted Jul 27, 2004·6 cites·8 claims
- 1653US2022389576A1Film-forming apparatus and method of using film-forming apparatusAIR WATER INC·Filed 2020·Application pending·0 cites
- 1752US12490486B2Compound semiconductor substrate and method for manufacturing compound semiconductor substrateAIR WATER INC·Filed 2021·Granted Dec 2, 2025·0 cites·8 claims
- 1851US2025006799A1Semiconductor substrate, semiconductor device, method for producing semiconductor substrate, and method for producing semiconductor deviceAIR WATER INC·Filed 2022·Application pending·0 cites
- 1949US2011073185A1Photovoltaic device and process for producing photovoltaic deviceMITSUBISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 2048US8986448B2Method of manufacturing single crystal 3C-SiC substrate and single crystal 3C-SiC substrate obtained from the manufacturing methodASAMURA HIDETOSHI·Filed 2011·Granted Mar 24, 2015·1 cites·18 claims
- 2148US6617034B1SOI substrate and method for production thereofNIPPON STEEL CORP·Filed 1999·Granted Sep 9, 2003·16 cites·4 claims
- 2248US2024290843A1Semiconductor element and production method for semiconductor elementAIR WATER INC·Filed 2022·Application pending·0 cites
- 2345US6274006B1Apparatus and method for treating exhaust gas and pulse generator used thereforMITSUBISHI HEAVY IND LTD·Filed 1999·Granted Aug 14, 2001·7 cites·2 claims
- 2445US2013004708A1Molding apparatus, method of forming molded product, and molded productSONY CORP·Filed 2012·Application pending·0 cites
- 2544US2016053875A1Vehicle power transmission apparatusHONDA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 2644US2009159432A1Thin-film deposition apparatus using discharge electrode and solar cell fabrication methodMITSUBISHI HEAVY IND LTD·Filed 2007·Application pending·0 cites
- 2743US8563442B2Method for manufacturing nitrogen compound semiconductor substrate and nitrogen compound semiconductor substrate, and method for manufacturing single crystal SiC substrate and single crystal SiC substrateKAWAMURA KEISUKE·Filed 2009·Granted Oct 22, 2013·0 cites·5 claims
- 2842US6344701B1Pulse generator for treating exhaust gasMITSUBISHI HEAVY IND LTD·Filed 1999·Granted Feb 5, 2002·6 cites·4 claims
- 2942US2022069090A1Compound semiconductor substrateAIR WATER INC·Filed 2020·Application pending·0 cites
- 3041US12230679B2Compound semiconductor substrate including nitride semiconductor layer having varying threading dislocation densitiesAIR WATER INC·Filed 2019·Granted Feb 18, 2025·0 cites·9 claims
- 3141US8931432B2Vacuum processing apparatusKAWAMURA KEISUKE·Filed 2008·Granted Jan 13, 2015·0 cites·6 claims
- 3241US2023343865A1Compound semiconductor substrate and compound semiconductor deviceAIR WATER INC·Filed 2021·Application pending·0 cites
- 3340US2005223990A1Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition processMITSUBISHI HEAVY IND LTD·Filed 2003·Application pending·0 cites
- 3439US10354864B2Compound semiconductor substrate with SiC layerAIR WATER INC·Filed 2016·Granted Jul 16, 2019·0 cites·5 claims
- 3539US2020402922A1Compound semiconductor substrateAIR WATER INC·Filed 2018·Application pending·0 cites
- 3638US12087852B2Compound semiconductor device, compound semiconductor substrate, and method for manufacturing compound semiconductor deviceAIR WATER INC·Filed 2019·Granted Sep 10, 2024·0 cites·10 claims
- 3737US8529704B2Vacuum processing apparatus and operating method for vacuum processing apparatusSASAKAWA EISHIRO·Filed 2008·Granted Sep 10, 2013·0 cites·6 claims
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