Inventor · disambiguated record
Rie Wada
Also filed as: WADA RIE
1 granted patent·2 pending applications·0 citations·filing 2010–2015
12Inventor score
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3 records- 0131US2012291922A1Solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
- 0230US2012291921A1Flux for solder paste, and solder pasteIWAMURA EIJI·Filed 2010·Application pending·0 cites
- 0329US9764430B2Lead-free solder alloy, solder material and joined structureKOKI KK·Filed 2015·Granted Sep 19, 2017·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →