Inventor · disambiguated record
Eiichi Asano
Also filed as: ASANO EIICHI
26 granted patents·4 pending applications·390 citations·filing 1991–2007
96Inventor score
Files withSHINETSU CHEMICAL CO22KOMATSU DENSHI KINZOKU KK3HOKKO CHEM IND CO2MITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
30 records- 0180US5175199AHigh transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1991·Granted Dec 29, 1992·47 cites·6 claims
- 0278US5940688AEpoxy resin composition and semiconductor device encapsulated therewithSHINETSU CHEMICAL CO·Filed 1997·Granted Aug 17, 1999·57 cites·10 claims
- 0376US6177489B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1998·Granted Jan 23, 2001·53 cites·11 claims
- 0474US6630745B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Oct 7, 2003·18 cites·9 claims
- 0572US6001901AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1997·Granted Dec 14, 1999·28 cites·9 claims
- 0671US7095125B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 22, 2006·15 cites·9 claims
- 0768US7943706B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted May 17, 2011·4 cites·4 claims
- 0864US7432603B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2005·Granted Oct 7, 2008·3 cites·3 claims
- 0963US5739187ASemiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1996·Granted Apr 14, 1998·30 cites·9 claims
- 1060US6518332B2Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 2001·Granted Feb 11, 2003·9 cites·12 claims
- 1159US6723452B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2002·Granted Apr 20, 2004·9 cites·16 claims
- 1256US6162878ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Dec 19, 2000·21 cites·13 claims
- 1353US6627328B2Light-transmissive epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted Sep 30, 2003·5 cites·15 claims
- 1453US6291556B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Sep 18, 2001·5 cites·10 claims
- 1553US6207296B1Inorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Mar 27, 2001·15 cites·6 claims
- 1651US6794058B2Flip-chip type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Sep 21, 2004·4 cites·2 claims
- 1749US8048969B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted Nov 1, 2011·0 cites·6 claims
- 1849US6297306B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Oct 2, 2001·15 cites·9 claims
- 1946US5935314AInorganic filler, epoxy resin composition, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Aug 10, 1999·11 cites·6 claims
- 2045US6894091B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2001·Granted May 17, 2005·1 cites·13 claims
- 2144US5990022AMethod of evaluating a silicon waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Nov 23, 1999·12 cites·7 claims
- 2244US2007207322A1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 2343US2007106036A1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 2442US2002058742A1Light-transmissive epoxy resin composition and flip-chip type semiconductor deviceFiled 2001·Application pending·0 cites
- 2542US2006241215A1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 2641US6274251B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1999·Granted Aug 14, 2001·9 cites·12 claims
- 2739US6168872B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceHOKKO CHEM IND CO·Filed 1998·Granted Jan 2, 2001·8 cites·20 claims
- 2835US5904568AMethod of manufacturing a semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted May 18, 1999·5 cites·7 claims
- 2932US6027812AEncapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction productSHINETSU CHEMICAL CO·Filed 1998·Granted Feb 22, 2000·3 cites·4 claims
- 3032US5897327AMethod of evaluating a semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1998·Granted Apr 27, 1999·3 cites·6 claims
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