Inventor · disambiguated record
Kenji Otoda
Also filed as: OTODA KENJI
1 granted patent·3 pending applications·9 citations·filing 2004–2006
31Inventor score
Top patents by PatentIndex Score
4 records- 0167US8276796B2Device and method for cutting off substrate of fragile materialNISHISAKA YUKI·Filed 2006·Granted Oct 2, 2012·9 cites·16 claims
- 0242US2007051769A1Brittle substrate cutting system and brittle substrate cutting methodMITSUBOSHI DIAMOND IND CO LTD·Filed 2004·Application pending·0 cites
- 0340US2009050610A1Method and apparatus for scribing brittle material board and system for breaking brittle material boardMITSUBOSHI DIAMOND IND CO LTD·Filed 2005·Application pending·0 cites
- 0437US2008305615A1Method of Scribing and Breaking Substrate Made of a Brittle Material and System for Scribing and Breaking SubstrateMITSUBOSHI DIAMOND IND CO LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →